Electronic part inspection device

ABSTRACT

An electronic component inspection apparatus includes an inspection socket which inspects a component, a tray disposition area in which a component waits before it is inspected, tray disposition areas which store a component after it has been inspected, components transfer mechanisms each of which has a vacuum or suction nozzle that can pick up and hold a component to transfer the component, a component position confirmation camera which can capture an image of the component that is being transferred, and a controller which transfers a component to the inspection socket, via a position in which the component position confirmation camera captures an image of the component being held by the suction nozzle while the component is being transferred from the tray disposition area to the inspection socket, and based on that captured image, controls the drive of the components transfer mechanisms so that the component is set in the inspection socket.

BACKGROUND OF THE INVENTION

1. Field Of The Invention

The present invention relates to an electronic component inspectionapparatus for inspecting package components such as a package IC, orelectronic components such as a bare chip that is diced from a wafer.

2. Description of the Related Art

In the manufacturing process for electronic components such as asemiconductor device, various inspections of the electronic component,such as an IC, which are finally manufactured, must be made. Forexample, there is known a device inspecting apparatus (i.e., anelectronic component inspection apparatus) , disclosed in JapanesePatent Laid-Open No. 10-148507.

This inspecting apparatus includes an unloader portion, a loaderportion, an empty tray portion, a heating portion, two sorting portions,an IC socket, a component transfer mechanism, and the like. The firstsorting portion, the unloader portion, the loader portion and the emptytray portion are disposed in line in the X-axis direction. The IC socket(i.e., an inspection portion) is disposed in the Y-axis directionseparate from the above-described elements. In addition, the secondsorting portion and the heating portion are disposed in line away fromthe first sorting portion and the like in the Y-axis direction.

A component on the loader portion is transferred to the heating portion,using a suction pad (hereinafter, referred to as a suction nozzle) ofthe component transfer mechanism (hereinafter, referred to as acomponent transferring device). Then, the heated component (hereinafter,referred to as the component) is transferred to the IC socket and isinspected. Among the components that have been inspected, the one whichhas met a standard is transferred to the unloader portion, and the onewhich has not met the standard is transferred to the first or secondsorting portion, respectively, by the component transfer mechanism.

In such an inspecting apparatus, an inspection of the components is doneafter they have been precisely positioned in a predetermined directionwith respect to the inspection portion. This is important to realizefirm and precise inspections of components. In the apparatus accordingto the prior art, a CCD camera is placed in the component transferringdevice so that components on the loader portion are imaged before theyare inspected, so that the positions or other characteristics of thecomponents can be determined from those images. Thus, the positions inwhich the components will be picked up by the suction nozzle arecorrected in advance, and then, the components are picked up andtransferred.

However, when the components are picked up by the suction nozzle, theymay slip out of position. Also, while the components are beingtransferred, they may be shaken, or other problems may occur, such thatthe position of the component relative to the suction nozzle shifts.Therefore, in the apparatus according to the prior art, componentscannot necessarily be precisely positioned in the inspection portion.Hence, this problem needs to be corrected.

According to the above-described prior art, right before components areset in the inspection portion, a component can be positioned and set afirst time, and an image of the component can be captured by a CCDcamera. Then, the position of the component is corrected and it issuctioned and picked up again, and then, it is set again in theinspection portion. However, even in that case, when a component ispicked up after its image has been captured, a suction shift may occur.Besides, a component has to be picked up again, which takes additionaltime. This prevents components from being inspected effectively andprecisely.

In addition, in the apparatus according to the prior art, the sortingportions or the inspection portion is located in a position which isdisplaced in the Y-axis direction from the loader portion or the like.Therefore, when the component transferring device transfers componentsfrom the loader portion to the inspection portion, or when it transferscomponents from the inspection portion to the unloader portion or thesorting portions (especially, to the side of the heating portion), thesuction nozzle needs to be extensively moved not only in the X-axisdirection but also in the Y-axis direction. Hence, the apparatus tendsto become larger in the Y-axis direction, thereby preventing a reductionin the size of the apparatus. Besides, the suction nozzle moves over agreat distance in both the X-axis and Y-axis directions. This makes itdifficult, for example, to increase the transfer speed from theviewpoint of control, thus preventing accurate and efficientinspections.

SUMMARY OF THE INVENTION

In order to overcome the problems described above, preferred embodimentsof the present invention provide an electronic component inspectionapparatus which is capable of inspecting components effectively andprecisely, and which has a significantly reduced size.

An electronic component inspection apparatus according to a preferredembodiment of the present invention includes an inspection portion whichinspects a component, a component standby portion in which a componentwaits before it is inspected, a component storage portion which stores acomponent after it has been inspected, a component transferring devicewhich has a suction nozzle that applies suction to and picks up acomponent and transfers the component between the component standbyportion or component storage portion and the inspection portion, animage capture device which captures an image of the component that isbeing transferred by the component transferring device, and a controllerthat transfers the component to the inspection portion, via a positionin which the image capture device captures an image of the state inwhich the component is held by the suction nozzle while the component isbeing transferred from the component standby portion to the inspectionportion, and based on that captured image result, controls the drive ofthe component transferring device so that the component is set in theinspection portion.

Furthermore, an electronic component inspection apparatus according toanother preferred embodiment of the present invention includes aninspection portion which inspects a component, a component standbyportion in which a component waits before it is inspected, a componentstorage portion which stores a component after it has been inspected,and a component transferring device which has a suction nozzle thatapplies suction to and picks up a component and transfers it between thecomponent standby portion or component storage portion and theinspection portion, wherein the inspection portion, the componentstandby portion and the component storage portion are disposed in a linewithin a range of motion of the suction nozzle.

Other features, elements, steps, characteristics and advantages of thepresent invention will become more apparent from the following detaileddescription of preferred embodiments thereof with reference to theattached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an electronic component inspectionapparatus according to a first preferred embodiment of the presentinvention.

FIG. 2 is a top view of the electronic component inspection apparatusaccording to the first preferred embodiment, seen from the Z-axisdirection in FIG. 1.

FIG. 3 is a side view of the electronic component inspection apparatusaccording to the first preferred embodiment, seen from the X-axisdirection in FIG. 1.

FIG. 4 is a front view of the electronic component inspection apparatusaccording to the first preferred embodiment, seen from the Y-axisdirection in FIG. 1.

FIG. 5 is a representation, showing the relationship between a traydisposition area and a stocker disposition area.

FIG. 6 is a table, showing an example of the disposition of a tray T inthe tray disposition area.

FIG. 7 is an enlarged side view of a stocker.

FIG. 8 is an enlarged front view of the stocker.

FIGS. 9A-9C are representations showing movement of the tray T in thestocker.

FIG. 10 is an enlarged top sectional view of an inspection area.

FIG. 11 is an enlarged sectional view of the inspection area.

FIGS. 12A-12C are top views of a component position confirmation cameraand an inspection socket, showing examples of their disposition.

FIGS. 13A-13C are top views of the component position confirmationcamera and the inspection socket, showing examples of their disposition.

FIG. 14 is an enlarged top view of a components transfer mechanism.

FIG. 15 is an enlarged side view of a components transfer mechanism.

FIG. 16 is a timing chart, showing an operational process of theelectronic component inspection apparatus.

FIG. 17 is a top view of the electronic component inspection apparatuswhen it operates in accordance with the operational process shown in thetiming chart of FIG. 16.

FIG. 18 is a top view of the electronic component inspection apparatuswhen it operates in accordance with the operational process shown in thetiming chart of FIG. 16.

FIG. 19 is a top view of the electronic component inspection apparatuswhen it operates in accordance with the operational process shown in thetiming chart of FIG. 16.

FIG. 20 is a top view of the electronic component inspection apparatuswhen it operates in accordance with the operational process shown in thetiming chart of FIG. 16.

FIG. 21 is a top view of the electronic component inspection apparatuswhen it operates in accordance with the operational process shown in thetiming chart of FIG. 16.

FIG. 22 is a top view of the electronic component inspection apparatuswhen it operates in accordance with the operational process shown in thetiming chart of FIG. 16.

FIG. 23 is a top view of the electronic component inspection apparatuswhen it operates in accordance with the operational process shown in thetiming chart of FIG. 16.

FIG. 24 is a top view of the electronic component inspection apparatuswhen it operates in accordance with the operational process shown in thetiming chart of FIG. 16.

FIG. 25 is a top view of an electronic component inspection apparatusaccording to a second preferred embodiment of the present invention.

FIG. 26 is a top view of an electronic component inspection apparatusaccording to a third preferred embodiment of the present invention.

FIG. 27 is a top view of another electronic component inspectionapparatus according to the third preferred embodiment of the presentinvention.

FIG. 28 is a top view of an electronic component inspection apparatusaccording to a fourth preferred embodiment of the present invention.

FIG. 29 is an enlarged top view of a components transfer mechanism inthe electronic component inspection apparatus according to the fourthpreferred embodiment of the present invention.

FIG. 30 is an enlarged side view of a components transfer mechanism inthe electronic component inspection apparatus according to the fourthpreferred embodiment of the present invention.

FIG. 31 is a top view of an electronic component inspection apparatusaccording to a fifth preferred embodiment of the present invention.

FIG. 32 is a perspective view of an electronic component inspectionapparatus according to a sixth preferred embodiment of the presentinvention.

FIG. 33 is a side view of the electronic component inspection apparatusaccording to the sixth preferred embodiment, seen from the X-axisdirection in FIG. 32.

FIG. 34 is a front view of the electronic component inspection apparatusaccording to the sixth preferred embodiment, seen from the Y-axisdirection in FIG. 32.

FIG. 35 is an enlarged side view of a stocker in the electroniccomponent inspection apparatus according to the sixth preferredembodiment of the present invention.

FIG. 36 is an enlarged front view of the stocker in the electroniccomponent inspection apparatus according to the sixth preferredembodiment of the present invention.

FIGS. 37A-37C are representations showing a movement of a tray T in thestocker of the electronic component inspection apparatus according tothe sixth preferred embodiment of the present invention.

FIG. 38 is a side view of an electronic component inspection apparatusaccording to a seventh preferred embodiment of the present invention.

FIG. 39 is a side view of an electronic component inspection apparatusaccording to an eighth preferred embodiment of the present invention.

FIGS. 40A-40D are representations showing a movement of a tray T in thestocker of the electronic component inspection apparatus according tothe eighth preferred embodiment of the present invention.

FIG. 41 is a perspective view of an electronic component inspectionapparatus according to a ninth preferred embodiment of the presentinvention.

FIG. 42 is a top view of the electronic component inspection apparatusaccording to the ninth preferred embodiment of the present invention.

FIG. 43 is a side view of a tray movement mechanism, showing itsconfiguration.

FIG. 44 is a perspective view of a wafer movement unit, showing itsconfiguration.

FIG. 45 is a perspective view of a chip components removal device,showing its configuration.

FIG. 46 is a flow chart, showing an inspection operation in theelectronic component inspection apparatus according to the ninthpreferred embodiment of the present invention.

FIG. 47 is a perspective view of another electronic component inspectionapparatus according to the ninth preferred embodiment of the presentinvention.

FIGS. 48A and 48B are an enlarged top view and a sectional view of anexample of a component position adjustment mechanism.

FIGS. 49A-49C are representations showing the mechanism of a positionaladjustment by the component position adjustment mechanism shown in FIGS.48A and 48B.

FIG. 50 is an enlarged top view and sectional view of another example ofthe component position adjustment mechanism.

FIGS. 51A-51 Care representations showing the mechanism of a positionaladjustment by the component position adjustment mechanism shown in FIG.50.

FIGS. 52A-52D are representations showing the relation between an X-axisrail and a component transfer mechanism.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Hereinafter, an electronic component inspection apparatus according to afirst preferred embodiment of the present invention will be described indetail with reference to the drawings.

FIG. 1 is a perspective view of an electronic component inspectionapparatus 1A according to the first preferred embodiment of the presentinvention. FIGS. 2 to 4 are a top view, a side view and a front view ofthe electronic component inspection apparatus 1A, seen from the Z, X andY-axis directions in FIG. 1, respectively.

The electronic component inspection apparatus 1A is an apparatus thattransfers and inspects an electronic component D. As shown in FIGS. 1 to4, the electronic component inspection apparatus 1A is preferablyconfigured by combining an electronic component transfer unit 100A,which transfers the electronic component D, and an electronic componentinspection unit 200, which inspects the electronic component D.

The electronic component inspection apparatus 1A is the electroniccomponent transfer unit 100A which mainly transfers components to beinspected, before an inspection plate 153 which includes inspectionsockets 152 a, 152 b (described later) is attached, or after theinspection plate 153 has been attached. Alternatively, in addition tothe electronic component transfer unit 100A, it is an apparatus whichincludes the electronic component inspection unit 200 that is a unitrelated to the inspection control of electronic components. Herein, theelectronic component inspection unit 200 is preferably connected via asignal line to the inspection sockets 152 a, 152 b and a control portion190 of the electronic component transfer unit 100A, respectively. Itexecutes an inspection of an electronic component, and outputs dataconcerning the inspection result to the control portion 190 or anotherportion, or stores it, and in addition, displays it.

The electronic components D are general electronic components that mayinclude a semiconductor device such as an IC device, for example. A tray(mentioned later) is a container according to preferred embodiments ofthe present invention.

The electronic component transfer unit 100A preferably includes a basestand 110, two X-axis robots 120 (120 a, 120 b), a tray disposition area130 (130 a to 130 d), a stocker disposition area 140 (140 a to 140 d),an inspection area 150, a components transfer mechanism 160 (160 a to160 d), an X-direction tray transfer mechanism 170 (170 a, 170 b), aY-direction tray transfer mechanism 180 (180 a to 180 d), the controlportion 190, a cover 300, and other elements.

In the above-described configuration of the electronic componentinspection apparatus 1A, the elements represented by reference numeralsthat have an alphabetical suffix (e.g., a, b, etc.) are each describedbelow without a suffix (which is also applied even in the drawings),except in the case where they should be distinguished.

The base stand 110 preferably has a substantially rectangular shape atits upper surface, and has a substantially L-shape at its bottomsurface. Under the inspection area 150, the base stand 110 has a space111 that is preferably shaped like a substantially rectangularparallelepiped. In the space 111 , the electronic component inspectionunit 200 is inserted so as to be connected to the electronic componenttransfer unit 100A. The space 111 opens on both sides in. the X andY-axis directions, so that the electronic component inspection unit 200can be inserted even from either side in the X and Y-axis directions.

The X-axis robots 120 a, 120 b are not shown in detail in the figure,but these robots 120 a, 120 b include an X-axis rail which is defined bya fixed magnet, a linear motor which is defined by a movable magnet thatcan move along the X-axis rail, a screw shaft which is connected to aservo motor, a single screw robot which is defined by a movable nut thatis fitted to the screw shaft and the X-axis rail and that can move alongthe X-axis rail and prevented from turning, and other elements. TheX-axis robots 120 a, 120 b move the components transfer mechanisms 160 ato 160 d in the X-axis direction, and thereby, the X-axis robots 120 a,120 b transfer the electronic component D. According to this preferredembodiment, the two X-axis robots 120 a, 120 b are preferably used, thusincreasing the efficiency of inspections.

According to this preferred embodiment, the X-axis robots 120 a, 120 bdefine the track according to various preferred embodiments of thepresent invention. The X-axis robots 120 a, 120 b and componentstransfer mechanisms 160 a to 160 d define the component transfer deviceaccording to various preferred embodiments of the present invention. Asdescribed above, if the X-axis robots 120 a, 120 b have the X-axis rail,the X-axis rail can also be regarded as the track according to variouspreferred embodiments of the present invention.

The tray disposition area 130 is set between the X-axis robots 120 a,120 b on the base stand 110. It includes four substantially rectangularareas (i.e., the tray disposition areas 130 a to 130 d) in which traysT1 to T4 are each disposed.

Specifically, as shown in FIG. 5, the tray disposition area 130 isdivided into the tray disposition area 130 a (i.e., the componentstorage portion according to preferred embodiments of the presentinvention) in which the tray T1 is disposed that stores, from among thecomponents that have already been inspected, components that have beendetermined to meet a standard, the tray disposition area 130 b (i.e.,the component storage portion according to preferred embodiments of thepresent invention) in which the tray T2 is disposed that stores, fromamong the components that have already been inspected, components thathave been determined not to meet the standard, the tray disposition area130 c in which the empty tray T3 is disposed, and the tray dispositionarea 130 d (i.e., the component standby portion according to preferredembodiments of the present invention) in which the tray T4 is disposedthat stores components that have not yet been inspected.

These tray disposition areas 130 a to 130 d are arranged in line in theX-axis direction, together with the inspection sockets 152 a, 152 b(described later). Hence, the trays T1 to T4 are disposed in line in theX-axis direction. This saves space in the Y-axis direction therebyreducing the size of the electronic component inspection apparatus 1A.

As described later, by the components transfer mechanism 160, theelectronic components D are transferred to the inspection area 150 fromthe tray T4 of the tray disposition area 130 d, and then, the componentsare inspected. On the other hand, by the components transfer mechanism160, the electronic components D which have been inspected aretransferred from the inspection area 150 to the tray disposition area130 a or 130 b. Then, based on the inspection results, they are storedin the tray T1 or T2. If the tray T4 of the tray disposition area 130 dbecomes empty (i.e., if it becomes the empty tray T3) when theelectronic components Dare removed, then by the X-direction traytransfer mechanism 170, the empty tray T3 is transferred from the traydisposition area 130 d to the tray disposition area 130 c.

The tray disposition area 130 can be suitably set to be longer in theY-axis direction than the side of each tray T1 to T4 in the Y-axisdirection, and shorter than twice its length.

The specific configuration of the trays T1 to T4 is not limitedaccording to various preferred embodiments of the present invention.However, on each of their upper surfaces, a structure (e.g., hollows orprotrusions) is preferably formed and is used to sort the electroniccomponents D and place the components. In the example shown in thefigure, the electronic components D can be stored, ten pieceslongitudinally and five pieces laterally.

Herein, the trays T1 to T4 are described below simply as the tray Twithout any reference number, except the case where they especially needto be distinguished from each other.

Hereinafter, the disposition of the tray T will be described in furtherdetail.

According to this preferred embodiment, as described above, the trays Tare arranged in the tray disposition areas 130 a to 130 d in the orderof the trays T1, T2 for components that have already been inspected, theempty tray T3 and the tray T4 for components that have not yet beeninspected. However, this order can be suitably changed. As an example ofthe disposition of the trays T, dispositions 1 to 3 in FIG. 6 can beconsidered. Among them, the disposition 1 is a disposition that isalready shown according to this preferred embodiment.

According to the dispositions 1 to 3 in FIG. 6, the tray T4 forcomponents that have not yet been inspected is disposed on the side (oron the right-hand side in the figure) of the inspection area 150 fromthe two trays T1 , T2 for components that have already been inspected.If the trays are disposed in this way, the electronic components D thathave not yet been inspected can be prevented from getting. mixed intothe trays T1 , T2 for components that have already been inspected. Inother words, when the electronic components D that have not yet beeninspected are transferred to the inspection area 150, they will not passthrough the trays T1 , T2 for components that have already beeninspected. Therefore, even if the electronic components D that have notyet been inspected drop from the components transfer mechanism 160, theywill not get mixed into the trays T1, T2 for components that havealready been inspected.

In addition, according to the disposition 1 in FIG. 6, the empty tray T3is disposed between the trays T1, T2 for components that have alreadybeen inspected and the tray T4 for components that have not yet beeninspected. Therefore, there is an advantage in that the empty tray T3can be quickly moved between the disposition area 130 d of the tray T4for components that have not yet been inspected and the dispositionareas 130 a, 130 b of the trays T1, T2 for components that have alreadybeen inspected, and the disposition area 130 c of the empty tray T3.Such a movement of the tray T3 is achieved using the X-direction traytransfer mechanism 170.

If there is no problem in that the electronic components D may drop fromthe components transfer mechanism 160, in the dispositions shown in FIG.6, the disposition of the tray T4 for components that have not yet beeninspected and the disposition of the trays T1 , T2 for components thathave already been inspected may also be switched. Even in either case,the distance by which the electronic components D are transferredremains unchanged, thereby keeping the speed of inspections at the samelevel.

With respect to the two trays T1, T2 for components that have alreadybeen inspected, which of them should be disposed in the tray T1 forup-to-standard components or the tray T2 for below-standard components,in other words, which of the trays T1, T2 should be disposed on the sideof the inspection area 150, may be determined according to the yield ofan inspection.

Generally, such a yield is about 50% or higher, and thus, if the tray T1for up-to-standard components is placed closer to the inspection area150 than the tray T2 for below-standard components, the speed ofinspections can be increased.

In contrast, if the yield is lower than about 50%, the tray T2 forbelow-standard components should be placed closer to the inspection area150 than the tray T1 for up-to-standard components. This is advantageousto make the speed of inspections higher.

According to such a yield, the number of the required trays T1 forup-to-standard components is different from that of the required traysT2 for below-standard components. Usually, the yield is about 50% orhigher, and consequently, the number of the trays T1 for up-to-standardcomponents becomes larger.

The tray T1 to T4 of each tray disposition area 130 a to 130 d is movedindependently of each other in the Y-axis direction, by the Y-directiontray transfer mechanism 180 (described later). Therefore, even if thecomponents transfer mechanism 160 is not moved (i.e., if it is givenlittle or no movement) in the Y-axis direction, the electroniccomponents D can be attached and detached at a desirable place inside ofthe trays T1 to T4. In other words, all the electronic components D thatare stored in the tray T can be inspected, and the already-inspectedelectronic components D can be stored in all the storage places of thetray T. Hence, the whole tray T can be used efficiently, thus reducingthe number of the trays T that are provided based on the number of theelectronic components D.

Furthermore, the movement of the electronic components D by thecomponents transfer mechanism 160 and the movement of the tray T by theY-direction tray transfer mechanism 180 can be performed at the sametime. This makes the speed of inspections higher and makes an inspectionprocess more efficient.

The tray T is also moved when all the electronic components D have beentransferred from the tray for not-yet-inspected components, and when thealready-inspected electronic components D have filled the tray foralready-inspected components. In other words, the tray T4 fornot-yet-inspected components that has become empty is moved to the traydisposition area 130 c of the empty tray T3. Then, by the Y-directiontray transfer mechanism 180, the tray T1 (or the tray T2) foralready-inspected components, which is full of the electronic componentsD, is sent out to the stocker disposition area 140 (described later).

Thereafter, the empty tray T3 on the tray disposition area 130 c ismoved to the tray disposition area 130 a (or 130 b) foralready-inspected components. This movement is made by the X-directiontray transfer mechanism 170, but it may also be conducted using asuction head 165 (described later). In such a case, the suction head 165transfers the electronic component D and also transfers the tray T. Thisreduces production costs for the apparatus (i.e., it makes it possibleto omit the X-direction tray transfer mechanism 170).

FIG. 5 shows the relationship between the tray disposition area 130 andthe stocker disposition area 140 (described later). As shown in thisfigure, the stocker disposition area 140 is disposed along the X-axisrobot 120 b, and it is divided into the four stocker disposition areas140 a to 140 d which correspond to the above-described tray dispositionareas 130 a to 130 d.

In each stocker disposition area 140 a to 140 d, stocker dispositionareas 141 a to 141 d are disposed and can store the trays T, which arepiled. Specifically, four openings are formed along the X-axis robot 120b on the base stand 110, and in these openings, the stocker dispositionareas 141 a to 141 dare each disposed so as to be attached and detached.

Among these stockers 141 (or the stockers 141 a to 141 d), the stockers141 a, 141 b are stockers for already-inspected components (e.g., forup-to-standard components and for below-standard components,respectively) which store the trays T1, T2, respectively. The stocker141 c is an empty-tray storage stocker that stores the tray T3. Thestocker 141 d is a stocker for not-yet-inspected components that storesthe tray T4.

As described already, the stocker disposition area 140 is divided intothe stocker disposition areas 140 a, 140 b for already-inspectedcomponents trays, the stocker disposition area 140 c for empty trays,and the stocker disposition area 140 d for not-yet-inspected componentstrays. The stockers 141 a to 141 d are each disposed in these divisionareas. The division areas correspond to the tray disposition areas 130 ato 130 d, respectively.

In this way, each stocker 141 stores a predetermined tray T so that itcorresponds to the division areas of the tray disposition area 130.Thus, the tray T can be efficiently transferred between the stocker 141and the tray disposition area 130. According to this preferredembodiment, the above-described stockers 141 a to 141 d, which aredisposed in the stocker disposition area 140, each defines the containerstorage portion according to various preferred embodiments of thepresent invention.

FIG. 7 and FIG. 8 are a side view and a front view of the stocker 141(141 a to 141 d).

With respect to the stockers 141 a to 141 d, the trays T which they eachstore have different roles, but the configurations of the trays are thesame. Therefore, the stockers 141 a to 141 d are described below withoutan alphabetical suffix (which is also applied even in the drawings)except in the case where they should be distinguished.

The stocker 141 preferably includes four struts 143, a bottom portion144, four tray separation hooks 145, and a tray lift mechanism 146.Inside of it, a tray-transfer-mechanism entry region 147 is formed whichthe Y-direction tray transfer mechanism 180 (described later) enters.The struts 143, the tray separation hooks 145 and thetray-transfer-mechanism entry region 147 are disposed above the uppersurface of the base stand 110. The bottom portion 144 and the tray liftmechanism 146 are disposed below the upper surface of the base stand110.

The strut 143 is connected to a member which is connected to the basestand 110 and is a pillar which has a substantially L-shape section. Itcorresponds to each of the four corners of the tray T and prevents thetray T from moving in the two-axis directions of X-Y.

The bottom portion 144 is connected to the struts 143, and preferablyincludes a bottom plate that preferably has a substantially rectangularshape, and four side plates. The side plates may also be excluded, andin that case, the struts 143 are connected directly to the bottom plate,which is the bottom portion 144.

Herein, the stocker 141 has, at its front wall (i.e., in the figure,right-hand portion), a door that can be opened and closed. Thus, thetray T can be easily inserted into, and carried out from, the stocker141. A ceiling portion 142 cannot be detached and attached as theceiling of the stocker 141. However, in the case where the tray T is,from above the stocker 141, inserted into and carried out from thestocker 141, it can be detached and attached.

The tray separation hooks 145 are disposed in the member to which thefour struts 143 are connected. The tray separation hooks 145 aredisposed on opposite sides relative to each other of the lowermost trayT inside of the stocker 141. Specifically, a concave portion ispreferably formed on each opposite side of the tray T, and the trayseparation hook 145 is inserted into the concave portion of the tray T.This prevents the lowermost tray T from dropping downward (i.e., in thenegative Z direction). A drive mechanism (not shown) is connected to thetray separation hooks 145, and the tray separation hooks 145 areinserted into the concave portions on the sides of the tray T and areremoved from them. Through the insertion and removal, the tray T isfixed and removed in the negative Z direction.

The tray lift mechanism 146 moves a flat plate (or a tray placementplate), which the tray T is placed on, up and down. The tray liftmechanism 146 lifts and lowers the tray T in the stocker 141.

The tray lift mechanism 146 can move up and down the tray placementplate, in a state where the Y-direction tray transfer mechanism 180 inwhich the tray T is not placed is located inside of thetray-transfer-mechanism entry region 147. In addition, the Y-directiontray transfer mechanism 180 has, on its tray side, a portion which iscut off into a substantially U-shape. Therefore, while the tray liftmechanism 146 is raising the tray placement plate, the Y-direction traytransfer mechanism 180 in which the tray T is not placed can be movedinto the tray-transfer-mechanism entry region 147. Hence, the trayplacement plate of the tray lift mechanism 146 can be lifted ahead,thereby shortening the time necessary for carrying the tray T out fromthe stocker 141.

The tray-transfer-mechanism entry region 147 is a space that preferablyhas a substantially rectangular parallelepiped shape. Thetray-transfer-mechanism entry region 147 is located above the uppersurface of the base stand 110 and below the tray separation hooks 145.The Y-direction tray transfer mechanism 180 moves into thetray-transfer-mechanism entry region 147 and moves out of thetray-transfer-mechanism entry region 147, from the positive Y-axisdirection.

The movement of the tray T from the inside of the stocker 141 to thetray disposition area 130 is achieved with the following process.Herein, an operation for the movement of the tray T inside of thestocker 141 is described with reference to FIGS. 9A-9C.

(1) The tray lift mechanism 146 operates to lift the tray placementplate. Then, if the tray placement plate comes into contact with thebottom surface of the lowermost tray Tin the stocker 141, the trayseparation hooks 145 are removed (i.e., the tray separation hooks 145are removed from the inside of the concave portions on the sides of thetray T) (see FIG. 9A).

(2) The tray lift mechanism 146 operates to move down the tray placementplate by a height of one tray T. Then, the second tray from the bottomis set to a height position that corresponds to the tray separationhooks 145.

(3) The tray separation hooks 145 operate to fix the second tray T fromthe bottom (i.e., the tray separation hooks 145 are inserted into theconcave portions on the sides of the second tray T from the bottom) (seeFIG. 9B).

(4) The tray lift mechanism 146 operates to move down the lowermost trayT together with the tray placement plate. At this time, the second trayT from the bottom is fixed to the tray separation hooks 145.

(5) The tray placement plate moves down further so that the lowermosttray T comes to a height position that corresponds to thetray-transfer-mechanism entry region 147. At this time, in advance, theY-direction tray transfer mechanism 180 moves into thetray-transfer-mechanism entry region 147 and stays there.

As a result, the tray T on the tray lift mechanism 146 descends onto theY-direction tray transfer mechanism 180 inside of thetray-transfer-mechanism entry region 147, and is placed there (see FIG.9C).

The tray T which has been placed on the Y-direction tray transfermechanism 180 remains and is held on the Y-direction tray transfermechanism 180, even if the tray placement plate moves down further. Inthis way, the tray T placed on the tray lift mechanism 146 istransferred to the Y-direction tray transfer mechanism 180.

(6) The Y-direction tray transfer mechanism 180 retreats from thetray-transfer-mechanism entry region 147, and thus, the tray T which isplaced on the Y-direction tray transfer mechanism 180 is carried outfrom the stocker 141 and is place in the tray disposition area 130.

The movement and placement of the tray T from the tray disposition area130 to the stocker 141 are achieved in the following way.

(1) In the state where the tray T is placed on the Y-direction traytransfer mechanism 180, the Y-direction tray transfer mechanism 180moves into the tray-transfer-mechanism entry region 147 from the traydisposition area 130. Thereby, the tray T is transferred into thestocker 141 (see FIG. 9C).

(2) The tray lift mechanism 146 operates to move up the tray placementplate. As a result, the tray T that is placed on the Y-direction traytransfer mechanism 180 is transferred to the tray lift mechanism 146(i.e., the tray placement plate).

The tray placement plate of the tray lift mechanism 146 ascends further,and the placed tray T is moved up to a height position in which it comesinto contact with the bottom surface of the lowermost tray T inside ofthe stocker 141 (see FIG. 9B).

(3) In the state where the tray T stays in contact by the tray liftmechanism 146, the tray separation hooks 145 are removed (i.e., the trayseparation hooks 145 are removed from the inside of the concave portionson the sides of the tray T).

(4) The tray lift mechanism 146 operates to move up the tray placementplate by the height of one tray T. Then, the tray T that is placed onthe tray lift mechanism 146 is brought to a height position thatcorresponds to the tray separation hooks 145 (see FIG. 9A).

(5) The tray separation hooks 145 operate to fix the tray T that isplaced on the tray lift mechanism 146.

In this way, the tray T on the tray disposition area 130 is stored andfixed in the lowermost portion inside of the stocker 141.

(6) Thereafter, the tray placement plate of the tray lift mechanism 146descends. At this time, the lowermost tray T of the stocker 141 is fixedto the tray separation hooks 145. Thus, even if the tray placement platemoves down, the tray T remains held inside of the stocker 141. The trayplacement plate of the tray lift mechanism 146 moves down below thetray-transfer-mechanism entry region 147.

In the manner described above, the tray T on the tray disposition area130 is stored and fixed in the lowermost portion inside of the stocker141.

Hence, the stockers 141 a to 141 d store the trays T such that they arepiled on top of one another, thus making it easier to exchange the trayT. In other words, the trays T are piled up above thetray-transfer-mechanism entry region 147, and thereby, the lowermosttray T of the stocker 141 is easily transferred to, and carried outfrom, the tray-transfer-mechanism entry region 147. Besides, thedistance between the tray-transfer-mechanism entry region 147 and thetray disposition area 130 is the same in any of the stockers 141. Thus,the time during which the tray T is transferred between them is uniform,thereby helping make the speed of inspections higher.

The inspection area 150 is located between X-axis robots 120 a, 120 b,and is preferably a substantially rectangular area which is set on theline along which the tray disposition area 130 extends in the X-axisdirection. Below it, the electronic component inspection unit 200 isdisposed.

FIG. 10 and FIG. 11 are a top view and a sectional view of theinspection area 150, respectively. As shown in these figures, in theinspection area 150, there are disposed two component positionconfirmation cameras 151 a, 151 b that define the image capturing deviceaccording to various preferred embodiments of the present invention, andthe two inspection sockets 152 a, 1 52 b that are the inspection portionaccording to various preferred embodiments of the present invention. Thecomponent position confirmation cameras 151 a, 151 b are placed on thebase stand 110. The inspection sockets 152 a, 152 b are placed on theinspection plate 153, and via the inspection plate 153, are set to thebase stand 110 so that they can be attached and detached. Thesecomponent position confirmation cameras 151 a, 151 b and inspectionsockets 152 a, 152 b are each described below without an alphabeticalsuffix (which is also applied even in the drawings) except in the casewhere they should be distinguished.

The component position confirmation cameras 151 a, 151 b are preferablyimage capturing cameras which are used to confirm the position (i.e.,the holding state) of the electronic components D which are transferredby the components transfer mechanism 160. The component positionconfirmation cameras 151 a, 151 b are preferably defined by a linesensor, a CCD camera, a vision camera or other suitable device. Theconfiguration of the component position confirmation cameras 151 a, 151b is not limited especially, as long as two-dimensional imageinformation (or in some cases, in one-dimensional image information) ofthe electronic components D can be obtained.

The component position confirmation cameras 151 a, 151 b are preferablyarranged along the Y-axis direction on the inspection area 150 and inline symmetrically with respect to the Y-axis direction. The componentposition confirmation cameras 151 a, 151 b each capture the image of theelectronic components D that pass over them. The captured image isprocessed, and thus, the position of the electronic components D withrespect to the components transfer mechanism 160 is detected. As aresult, when the electronic components D are suctioned and picked up atthe components transfer mechanism 160, the positional shift (in the X, Yand R-axis directions) of the electronic components D is detected. Thus,when the electronic components D are connected to the inspection socket152, the position of the electronic component D is corrected, therebymaking such a connection more certain. In other words, the electrodes ofthe electronic components D can be more reliably and accurately bebrought into contact with, and connected to, the electrodes of theinspection socket 152.

The component position confirmation cameras 151 a, 151 b can also beused to inspect the outside appearance of the electronic components D.In the same way as the case where the position of the electroniccomponents D is confirmed, the inspection is performed when thecomponents transfer mechanism 160 that has suctioned and picked up theelectronic component D passes over the component position confirmationcameras 151 a, 151 b. In this way, the electronic component inspectionapparatus 1A can inspect not only the electronic components Delectrically, but can also easily inspect the outside appearance of thecomponents. Besides, if a code is shown on the surface of the electroniccomponent D, such a code can be read using the component positionconfirmation cameras 151 a, 151 b. This makes it possible to judge thecomponent types from the electronic components D themselves (i.e., itmakes an inspection multifunctional).

The inspection sockets 152 a, 152 b are preferably electricallyconnected to both the electronic components D and the electroniccomponent inspection unit 200. Thus, it is an electric connection memberthat allows the electronic component inspection unit 200 to inspect theelectronic components D electrically.

The inspection sockets 152 a, 152 b are arranged in line in the Xdirection with respect to the Y-axis direction along the inspection area150. The inspection plate 153 is a substantially flat plate which theinspection sockets 152 a, 152 b are connected to, and it can be attachedto and detached from the base stand 110.

In the inspection area 150, the disposition of the component positionconfirmation camera 151 and the inspection socket 152 will be describedin detail.

According to this preferred embodiment, the number of the componentposition confirmation cameras 151 and the inspection sockets 152 ispreferably two, respectively, and the inspection sockets 152 arearranged in the Y-axis direction. However, the number and disposition ofthe component position confirmation cameras 151 and the inspectionsockets 152 can also be changed.

FIGS. 12A-12C and FIGS. 13A-C are top views of the component positionconfirmation camera 151 and the inspection socket 152, typically showingan example of their disposition. FIGS. 12A-12C show the case where thenumber of the component position confirmation cameras 151 is two, andFIGS. 13A-13C show the case where the number of the component positionconfirmation cameras 151 is one.

As shown in FIGS. 12A-12C and FIGS. 13A-13C, in examples of thedisposition of the component position confirmation camera 151 and theinspection socket 152, the number of the component position confirmationcameras 151 is one or two, and the number of the inspection sockets 152is two or four. Among these combinations, FIG. 12A corresponds to thedisposition according to the preferred embodiment shown in FIG. 10.

The greater the number of inspection sockets 152 used, the more easily alarger number of the electronic components D can be inspected at thesame time and in parallel. Besides, if a plurality of the componentposition confirmation cameras 151 is provided, the position of severalsuch electronic components D can be confirmed simultaneously.

It is preferable that the number and disposition of cameras 151 besuitably selected according to the number or disposition of thecomponents transfer mechanisms 160. According to this preferredembodiment, the inspection sockets 152 are disposed in the directionthat extends in the X-axis direction in a substantially middle of thetray T. This makes it possible to shorten the distance by which thecomponents transfer mechanism 160 moves in the Y-axis direction.

The direction in which the inspection plate 153 is attached to the basestand 110 is kept fixed. The attachment types of two types of theinspection plates 153 in FIGS. 12A and 12B and FIGS. 13A and 13B aresupposed to be recognized using an inspection-position confirmationcamera 154 (described later), or inputted in the control portion 190using an input unit (not shown).

As shown in FIGS. 12A and 12B and in FIGS. 13A and 13B, the direction inwhich the inspection plate 153 is attached may also be changed. In thatcase, the direction in which the inspection sockets 152 are arranged inline is changed from the X-axis direction to the Y-axis direction.

The direction in which the inspection sockets 152 a, 152 b are attachedcan be detected (i.e., the direction in which the inspection plate 153is attached can be detected) by recognizing their images using theinspection-position confirmation camera 154, or by inputting data.However, according to this preferred embodiment, as shown in FIG. 10 andFIG. 11, the attachment direction is detected by forming an openingportion 155 in the inspection plate 153 and forming, in the base stand110, an opening detection portion 156 which corresponds to the openingportion 155. In other words, the opening portion 155 is detected by theopening detection portion 156, and based on whether it is detected ornot, the direction in which the inspection plate 153 is attached can bedetected.

As the opening detection portion 156, for example, an optical sensor canbe used. Specifically, for example, as shown in FIG. 11, above theopening detection portion 156, a light emitting portion 157 is provided.Based upon whether or not the light that is emitted from the lightemitting portion 157 and transmitted toward the opening detectionportion 156 is shielded by the inspection plate 153, the direction inwhich the inspection plate 153 is attached can be detected.

In addition, the opening detection portion 156 may also be configured bya limit switch. In that case, the opening portion 155 can be detectedusing the switching ON or OFF of the limit switch. If the openingportion 155 is located on the limit switch, the limit switch is turnedOFF. If the opening portion 155 does not come onto the limit switch, thelimit switch is pressed by the inspection plate 153, and it is turnedON. At this time, there is no need to configure the opening portion 155as a hole that penetrates the inspection plate 153. It is sufficientthat the opening portion 155 is a concave portion into which the tip ofthe limit switch can be inserted.

The components transfer mechanism 160 (160 a to 160 d) is used to pickup and transfer the electronic components D. The components transfermechanisms 160 a, 160 b are placed in the x-axis robot 120 a, and thecomponents transfer mechanisms 160 c, 160 d are placed in the X-axisrobot 120 b. In this way, the components transfer mechanisms 160 a, 160b and the components transfer mechanisms 160 c, 160 d are placed in thedifferent X-axis robots 120 a, 120 b, respectively. As a result, theelectronic components D can be transferred independently of each otherin the X-axis direction, thus increasing the efficiency of inspectionsof the electronic components D.

FIG. 14 and FIG. 15 are an enlarged top view and side view of thecomponents transfer mechanism 160, respectively. As shown in thesefigures, each components transfer mechanism 160 preferably includes anX-direction drive portion 161, a Y-direction drive portion 162, aZ-direction drive portion 163, an R-direction drive portion 164, thesuction head 165, and a suction nozzle 166.

Among the four components transfer mechanisms 160 a to 160 d, in thecomponents transfer mechanisms 160 a, 160 c on the side of the traydisposition area 130, the X-direction tray transfer mechanisms 170 a,170 b are provided, respectively. The inspection-position confirmationcamera 154 is connected to a suction head 165 b of the componentstransfer mechanism 160 b on its opposite side.

The X-direction drive portion 161 moves in the X-axis direction on theX-axis robot 120, thereby allowing the suction head 165 to move in theX-axis direction.

The Y-direction drive portion 162 is connected to the X-direction driveportion 161, and preferably includes by a Y-direction drive base body1621 and a Y-direction drive body 1622.

The Y-direction drive body 1622 is expanded and contracted in the Y-axisdirection with respect to the Y-direction drive base body 1621, so thatthe suction head 165 can be moved in the Y-axis direction. If thecomponents transfer mechanisms 160 a, 160 b come close to the componentstransfer mechanisms 160 c, 160 d in the X-axis direction, then theY-direction drive portion 162 allows the suction head 165 to move in theY-axis direction. As a result, the components transfer mechanisms 160a-160 d can be prevented from interfering (or coming into contact) witheach other.

The Z-direction drive portion 163 is connected to an end portion of theY-direction drive body 1622, and preferably includes a Z-direction drivebase body 1631 and a Z-direction drive body 1632. The Z-direction drivebody 1632 is moved up and down in the Z direction with respect to theZ-direction drive base body 1631, so that the suction head 165 can bemoved in the Z direction.

Such an up-and-down movement in the Z direction can also be made, likethe Y-direction drive portion 162, using a ball screw, ball nutmechanism, or a drive body such as a hydraulic cylinder mechanism and alinear motor mechanism. Conversely, in the Y-direction drive portion162, like the Z-direction drive portion 163, based upon a shift inmovement between members, the suction head 165 can be moved in theY-axis direction.

The R-direction drive portion 164 is connected to an upper end of theZ-direction drive body 1632, and is used to allow the suction head 165to rotate (i.e., rotate in the R direction, or rotate in the right andleft directions on the X-Y plane) along the Z axis.

The suction head 165 preferably includes a head body 1651, and asuction-nozzle support member 1652. The head body 1651 is connected tothe lower end of the Z-direction drive body 1632. The head body 1651 canbe moved independently in the X-axis, Y-axis and Z directions by theX-direction drive portion 161, the Y-direction drive portion 162 and theZ-direction drive portion 163, respectively.

The suction-nozzle support member 1652 is connected to a lower end ofthe head body 1651, and supports the suction nozzle 166. Thesuction-nozzle support member 1652 rotates with respect to the head body1651, using the R-direction drive portion 164.

At the time of these movements, the X-direction drive portion 161, thedistances by which the Y-direction drive portion 162, the Z-directiondrive portion 163 and the R-direction drive portion 164 are moved aredetected, using an encoder and the like. Then, feedback to the controlportion 190 is executed, thus making the control of the various driveportions 161-164 more precise and accurate.

The suction nozzle 166 is connected to the suction head 165 so that itcan be attached and detached. Inside of its tip, a negative or positiveair pressure is produced using a suction mechanism (not shown). As aresult, the suction nozzle 166 can apply suction or a vacuum to pick upand hold an electronic component D, and can release the suction orvacuum to release the electronic component D. The suction head 165 mayalso be replaced and changed according to the shape of the electroniccomponent D.

The suction nozzle 166 is connected to the suction head 165, and thus,it moves in the X, Y and Z directions and rotates on the R axis, alongwith each movement of the X-direction drive portion 161 , the distanceby which the Y-direction drive portion 162, the Z-direction driveportion 163 and the R-direction drive portion 164.

The inspection-position confirmation camera 154 is preferably located onthe side of the suction head 165 b. In the case where there is anidentification code on the inspection socket 152, the tray T and theinspection plate 153, the inspection-position confirmation camera 154can obtain the image of this identification code from above. Theinspection-position confirmation camera 154 is preferably configured bya line sensor, a CCD camera, a vision camera or other suitable device.The inspection-position confirmation camera 154 configuration is notlimited especially, as long as two-dimensional image information (or insome cases, one-dimensional image information) of the electroniccomponents D can be obtained. The image captured by theinspection-position confirmation camera 154 is processed, and thus, theposition of the inspection socket 152 or the tray T, and theidentification code, are detected.

The inspection-position confirmation camera 154 can placed in each ofthe components transfer mechanisms 160 a to 160 d. In this case, theposition of the electronic components D that have not yet been inspectedon the tray T can be confirmed, using the inspection-positionconfirmation camera 154. Then, based on the confirmed position, theposition of the suction nozzle 166 can be corrected. According to thisconfiguration, when the electronic components D are suctioned, a shiftin the position (i.e., in the X, Y and Z directions) of the electroniccomponents D with respect to the suction nozzle 166 is kept down. As aresult, when the electronic components D are suctioned by the suctionnozzle 166, the suction quality can be prevented from deteriorating,thus increasing the efficiency of inspections.

Furthermore, the position of the inspection socket 152 is confirmed, andwhen the electronic components D are connected (or attached) to theinspection socket 152, the position of the electronic components D canbe corrected. As a result, when the electronic components D are attachedto the inspection socket 152, the attachment quality can be preventedfrom deteriorating, thus making an inspection more accurate andreliable.

As shown in FIG. 14 and FIG. 15, the X-direction tray transfer mechanism170 (170 a, 170 b) preferably includes a Z-direction tray drive portion171, and a tray suction portion 172.

The Z-direction tray drive portion 171 is connected to the Y-directiondrive base body 1621. The Z-direction tray drive portion can be moved inthe X-axis direction by the X-direction drive portion 161 , and movesthe tray suction portion 172 up and down.

The tray suction portion 172 is preferably a flat plate that can bemoved in the X and Z directions by the X-direction drive portion 161 andthe Z-direction tray drive portion 171. Along a lower surface of thetray suction portion 172, there are formed one or several suction holes(not shown). The tray suction portion 172 is connected to a suctionmechanism (not shown). The tray suction portion 172 applies a vacuum viathe suction hole and stops the vacuum, so that the tray T can besuctioned/picked up and released. The suctioning/picking up andreleasing of the tray T by the tray suction portion 172 and thesuctioning/picking up and releasing of the electronic components D bythe suction nozzle 166 can be conducted independently of each other.

Using the X-direction tray transfer mechanism 170, the tray T on thetray disposition area 130 can be transferred. This transfer is conductedas described below.

(1) The X-direction drive portion 161 moves the tray suction portion 172in the X-axis direction and moves it above the tray T to be transferred.

(2) The Z-direction tray drive portion 171 moves the tray suctionportion 172 down, and allows its lower surface to come into contactwith, or come close to, the upper surface of the tray T to betransferred.

(3) The tray suction portion 172 is operated so that the tray suctionportion 172 suctions the tray T.

(4) The Z-direction tray drive portion 171 moves the tray suctionportion 172 up. The tray T that has been suctioned by the tray suctionportion 172 moves up together with the tray suction portion 172.

(5) The X-direction drive portion 161 moves the tray suction portion 172that has suctioned the tray T onto a transfer target position in theX-axis direction.

(6) The Z-direction tray drive portion 171 moves the tray suctionportion 172 that has suctioned the tray T down, and allows the lowersurface of the tray T to come into contact with, or come close to, thetray disposition area 130.

(7) The suction or vacuum applied to the tray T by the tray suctionportion 172 is released, and the Z-direction tray drive portion 171moves the tray suction portion 172 up. As a result, the tray T that hasbeen released from the tray suction portion 172 remains at the place upto which it has been transferred.

This transfer of the tray T in the X-axis direction is used, forexample, in the case where, when the electronic components D are carriedout from the tray T4 for components that have not yet been inspected andthen the tray becomes empty, this empty tray is transferred to theposition of the tray T3 (i.e., the tray disposition area 130 c).

In addition, it is used in the case where, when the electroniccomponents D that have already been inspected fills the trays T1 , T2for components that have already been inspected, instead of these traysT1 , T2, the empty tray T3 is transferred to the position of the traysT1, T2 (i.e., the tray disposition areas 130 a, 130 b) as a new tray foralready-inspected components. The trays T1, T2 for already-inspectedcomponents that are full of the already-inspected electronic componentsD are transferred to the inside of the stocker 141 by the Y-directiontray. transfer mechanism 180.

The Y-direction tray transfer mechanism 180 (180 a to 180 d) is amechanism that transfers the tray T in the Y-axis direction between thetrays T1 to T4 and the stockers 141 a to 141 d. As shown in FIG. 7 andFIG. 8, the Y-direction tray transfer mechanism preferably includes ashaft 181 , a movement portion 182, a tray placement portion 183, and apair of tray fixing portions 184.

The shaft 181 is preferably a ball screw that is a substantiallycylindrical pole with a screw thread. The shaft is arranged to extendalong the direction from the tray disposition area 130 to the stockerdisposition area 140 (specifically, the tray-transfer-mechanism entryregion 147 inside of the stocker 141). The shaft 181 is connected to arotation mechanism that preferably includes a servo motor (not shown).When the rotation mechanism operates, the shaft 181 rotates on its axis.When the shaft 181 rotates, the operational quantity of the rotationmechanism is detected, using an encoder or other suitable device. Then,its feedback to the control portion 190 is executed, thus making suchcontrol more accurate and reliable.

The movement portion 182 is preferably shaped like a substantially flatplate, and has a ball nut portion. The ball nut portion is penetrated bythe shaft 181. When the shaft 181 rotates, the ball screw of the shaft181 engages with the ball nut of the movement portion 182, and thereby,the movement portion 182 moves forward and backward along the axis ofthe shaft 181.

The tray placement portion 183 preferably is defined by a substantiallyrectangular flat plate, and on this plate, the tray T is placed. Thetray placement portion 183 is connected, at its lower surface near oneof its ends, to a side of the movement portion 182. The tray placementportion 183 moves together with the movement portion 182 along the axisof the shaft 181.

The tray fixing portions 184 are each disposed at the four sides on theupper side of the tray placement portion 183. The tray fixing portions184 each preferably includes a rod member which has a substantiallyrectangular section. Among the four-side tray fixing portions 184, atleast one of the two sides in the X-axis direction can be moved in theX-axis direction, using a movement unit (not shown) Consequently, theinterval of the tray fixing portions 184 in the X-axis direction can besuitably controlled. The tray T on the tray placement portion 183 can bepressed and fixed on both sides.

Furthermore, among the four-side tray fixing portions 184, at least oneof the two sides in the Y-axis direction may also be moved in the Y-axisdirection, using a movement unit (not shown) In that case, the tray Tthat is different in size in the Y-axis direction can be transferred.

The Y-direction tray transfer mechanism 180 can be used in the casewhere the tray T is moved from the stocker 141 to the tray dispositionarea 130, or vice versa. In addition to this, the Y-direction traytransfer mechanism 180 moves the tray T inside of the tray dispositionarea 130, thus shortening the distance by which the suction head 165moves in the Y-axis direction. At this time, each tray T can be movedindependently or together as one body.

According to this preferred embodiment, the Y-direction tray transfermechanism 180 defines the container moving device and containertransferring device according to various preferred embodiments of thepresent invention. In other words, by the Y-direction tray transfermechanism 180, the container moving device is configured, and inaddition, the Y-direction tray transfer mechanism 180 is configured tohave the function of the container transferring device according tovarious preferred embodiments of the present invention.

In the electronic component inspection apparatus 1A, as described above,the Y-direction tray transfer mechanism 180 is provided. As a result,the components transfer mechanism 160 removes or inserts the electroniccomponents D from or into the tray T of the tray disposition area 130,without moving the suction nozzle 166 in the Y-axis direction.

The control portion 190 is disposed in the base stand 110, andpreferably includes a CPU 191, an ROM 192, an RAM 193, a communicationcontroller 194, an I/O controller 195, a motion controller 196, an imagecontroller 197, and other suitable elements. The control portion 190controls the drive of the electronic component transfer unit 100A, andcommunicates with a control portion (not shown) of the electroniccomponent inspection unit 200.

Based upon software which is stored in the ROM 192 and RAM 193, thecontrol portion 190 controls the drive of the electronic componenttransfer unit 100A and communicates with the electronic componentinspection unit 200, through the communication controller 194, I/Ocontroller 195, motion controller 196 and image controller 197. Thesoftware causes the transfers of the electronic components D and thetray T, according to a combination of the electronic components D to beinspected and the inspection socket 152, and a signal from theelectronic component inspection unit 200. The electronic componentinspection unit 200 conducts an inspection based on the software ofinspection contents that correspond to the electronic components D.According to this preferred embodiment, the CPU 191 functions as thecontrolling device that controls the drive of the componentstransferring device, and as the collision-prevention controlling device.

Each of the ROM 192 and RAM 193 is preferably a storage device thatstores fixed and temporary information. The ROM 192 and RAM 192 store,for example, software which represents an operational process andcontents of the electronic component transfer unit 100A, informationwhich represents a situation of the electronic component transfer unit100A, and other suitable information and software. This informationincludes information on components suction at the time when the suctionhead 165 has suctioned the electronic components D on the tray T,information on components attachment at the time when the electroniccomponent D have been attached to the inspection socket 152, and othersuitable information. Such information is referred to when the suctionhead 165 suctions/picks up and releases the electronic component D,thereby eliminating malfunctions more certainly.

The ROM 192 and RAM 193 also store information on an attachmentdirection of the inspection socket 152 which the I/O controller 195 hasreceived from the opening detection portion 156, and software forrotating or moving the suction head 165 in response to this attachmentdirection. In other words, the suction head 165 is rotated or moved soas to correspond to the inspection socket 152, so that the electroniccomponents D can be firmly attached to the inspection socket 152. Inorder to increase the efficiency of inspections (i.e., in order toprevent the speed of inspections from being reduced) it is preferablethat the suction head 165 be rotated while the suction head 165 ismoving.

The communication controller 194 communicates with the electroniccomponent inspection unit 200. The communication controller 194 outputs,to the electronic component inspection unit 200, for example,information on whether the electronic components D are properly placedin the inspection socket 152, or further, information on the types ofthe electronic components D. The communication controller 194 inputs,from the electronic component inspection unit 200, information oninspection the results of inspection of the electronic components D bythe electronic component inspection unit 200. The communicationcontroller 194 also inputs and outputs information on a unit state thatrepresents a state of the electronic component transfer unit 100A, andother suitable information. Hence, when the electronic components D aretransferred and inspected, information is exchanged between theelectronic component transfer unit 100A and the electronic componentinspection unit 200.

The communication between the communication controller 194 (i.e., theelectronic component transfer unit 100A) and the electronic componentinspection unit 200 can be conducted by various methods, such as wireand radio. For example, if an operator connects a signal coupler,communication can be conducted between the electronic component transferunit 100A and the electronic component inspection unit 200. In addition,when the electronic component inspection unit 200 is inserted in thespace 111 under the electronic component transfer unit 100A, signalcouplers of both the electronic component inspection unit 200 and theelectronic component transfer unit 100A may also be automaticallyconnected.

The I/O controller 195 and the motion controller 196 are each connectedto the components transfer mechanism 160, the X-direction tray transfermechanism 170, the Y-direction tray transfer mechanism 180, and a driveunit (not shown) that drives the stocker 141. The drive unit isconnected to the X-direction drive portion 161, the Y-direction driveportion 162, the Z-direction drive portion 163, the R-direction driveportion 164, or other suitable elements.

The I/O controller 195 inputs, from the components transfer mechanism160 or the like, state information on its state. The motion controller196 outputs, to the components transfer mechanism 160 or the like, anoperation command on the contents of an operation.

Consequently, control or other characteristics of the suction isexecuted to achieve the suction/pick-up, transfer and release of theelectronic components D by the components transfer mechanism 160, andthe suction/pick-up, transfer and release of the tray T by theX-direction tray transfer mechanism 170, and the fixing, transfer andfixing removal of the tray T by the Y-direction tray transfer mechanism180, and the transfer of the tray T to and from the stocker 141, or thelike.

In addition, the I/O controller 195 receives, from the opening detectionportion 156, information on the direction in which the inspection socket152 is attached. This information is used to rotate or move the suctionhead 165 so that it corresponds to the inspection socket 152, andthereby, to allow the electronic components D to be certainly attachedto the inspection socket 152.

The image controller 197 is connected to the component positionconfirmation cameras 151 a, 151 b and the inspection-positionconfirmation camera 154. The image controller 197 outputs an imagecapture command which is used to command the cameras 151 a, 151 b, 154to capture an image, inputs the result of a captured image (i.e., imageinformation) from the cameras 151 a, 151 b, 154, or conducts such anoperation. The captured image information is processed by the CPU 191.Consequently, the position of the suction head 165, the position of theelectronic component D with respect to the suction head 165, theposition of the inspection socket 152 or the tray T, the position of theelectronic component D with respect to the inspection socket 152 or thetray T, and the like, are detected.

A control portion (not shown) on the side of the electronic componentinspection unit 200 which controls an input and an output of a signalfor inspecting an electronic circuit, and the control portion 190 whichmainly controls the side of the electronic component transfer unit 100A,may also be united. In that case, they are disposed on the side of theelectronic component inspection unit 200, or they are disposed on theside of the electronic component transfer unit 100A.

The electronic component inspection unit 200 is electrically connectedto the inspection socket 152, and inspects the electronic component Delectrically.

In the electronic component inspection unit 200, a measuring device andthe like are provided to inspect the electronic components D. Thesemeasuring devices are electrically connected to the inspection socket152. As a result, the electronic component inspection unit 200 caninspect the electronic components D via the inspection socket 152.

The electronic component inspection unit 200 is configured to beinserted into the space 111 of the base stand 110, from either of thetwo X and Y directions. This is because the space 111 is opened in thetwo directions on the sides of the electronic component transfer unit100A. Consequently, the electronic component transfer unit 100A can beeasily connected to the electronic component inspection unit 200.

Next, an operation will be described which is conducted to inspectcomponents using the electronic component inspection apparatus 1A, basedon the control of the control portion 190.

FIG. 16 is a timing chart, showing an operational process of theelectronic component inspection apparatus 1A. FIG. 17 to FIG. 24 are topviews which show the state of the electronic component inspectionapparatus 1A when it operates according to the operational process shownin FIG. 16.

In FIG. 16, the horizontal axis is time and the vertical axis representsan output state of a drive instruction in each of the X, Y, Z and Rdirections. The suffixes a to d of X, Y, Z and R shown here correspondto the components transfer mechanisms 160 a to 160 d, respectively.Within a period of time shown in FIG. 16, suction heads 165 c, 165 d donot move in the X and R directions. Thus, in FIG. 16, the description ofXc, Xd, Rc, Rd is omitted. In addition, in the following description, inorder to distinguish electronic components that are held by each of thecomponents transfer mechanisms 160 a to 160 d, the numerals 1 to 6 aregiven to the reference character D.

(1) Time t0 (see FIG. 17)

At a time t0, electronic components D1, D2 are connected to theinspection sockets 152 a, 152 b, and are being inspected.

Suction heads 165 a, 165 b are pressing the electronic components D1 ,D2 which are connected to the inspection sockets 152 a, 152 b againstthe inspection sockets 152 a, 152 b, respectively. On the other hand,the suction heads 165 c, 165 d are suctioning electronic components D3,D4 that have not yet been inspected, and are standing by in the negativeY-axis direction (i.e., downward in FIG. 17) of the suction heads 165 a,165 b, respectively.

(2) Time t1 to t2

At a time t1 , the inspection of the electronic components D1, D2 iscompleted.

The air pressure which is applied to the inside of each suction nozzle166 a, 166 b is switched from a positive pressure to a negativepressure. Then, the suction heads 165 a, 165 b each move in the positiveZ-axis direction (i.e., go upward). As a result, the electroniccomponents D1, D2 which have been suctioned/picked up by the suctionheads 165 a, 165 b move away from the inspection sockets 152 a, 152 b,respectively.

(3) Time t2 to t3 (see FIG. 18)

The suction heads 165 a to 165 d move together in the positive Y-axisdirection (i.e., upward in FIG. 18). Consequently, instead of thesuction heads 165 a, 165 b, the suction heads 165 c, 165 d are locatedabove the inspection sockets 152 a, 152 b.

(4) Time t3 to t4

At a time t3, the suction heads 165 a, 165 b start to move in thenegative X-axis direction (i.e., leftward in FIG. 18). Then, the suctionheads 165 c, 165 d move together in the negative Z-axis direction (i.e.,go downward). When the suction heads 165 c, 165 d reach a predeterminedheight position, the air pressure that is applied to the tip of eachsuction nozzle 166 c, 166 d is switched from a negative pressure to apositive pressure. Thereby, the electronic components D3, D4 which havebeen suctioned/picked up by the suction heads 165 c, 165 d are set tothe inspection sockets 152 a, 152 b. Then, at a time t4, an inspectionof the electronic components D3, D4 is started.

(5) Time t5 to t6 (see FIG. 19)

The suction heads 165 a, 165 b move in the X-axis direction. Thereby,the suction heads 165 a, 165 b and the suction heads 165 c, 165 d areshifted in the X-axis direction. At this time, when the suction head 165b passes through a position of the suction head 165 c (i.e., when theypass each other in the X-axis direction), the suction heads 165 a, 165 bmove in the negative Y-axis direction (i.e., downward in FIG. 18).

In other words, when the suction heads 165 c, 165 d (or the suctionheads 165 a, 165 b) on one side are located above the position of theinspection sockets 152 a, 152 b, if the suction heads 165 a, 165 b (orthe suction heads 165 c, 165 d) on the other side are moved in theX-axis direction, then the suction heads 165 a, 165 b and the suctionheads 165 c, 165 d interfere (or come into contact) with each other.However, as described above, the suction heads 165 a, 165 b (or thesuction heads 165 c, 165 d) on the one side move in the X-axis directionwhile they retreat in the Y-axis direction. As a result, the suctionheads 165 a, 165 b and the suction heads 165 c, 165 d are prevented frominterfering with each other. The area in which the suction heads 165 a,165 b and the suction heads 165 c, 165 d interfere (or come intocontact) with each other is called a head interference area (which isshown by reference characters Ai in FIG. 17 to FIG. 24), according tothis preferred embodiment. When the suction heads 165 a, 165 b and thesuction heads 165 c, 165 d pass each other, as described above, thesuction heads 165 a, 165 b (or the suction heads 165 c, 165 d) on theone side are located outside of the head interference area Ai. As aresult, the suction heads 165 a, 165 b and the suction heads 165 c, 165d are prevented from interfering (or coming into contact) with eachother.

(6) Time t7 to t8 (see FIG. 20)

Among the trays T for the components that have already been inspected,the tray T1 is a tray for components that meet a predetermined standard,and the tray T2 is a tray for components meet a predetermined standard.On the other hand, the electronic components D1 of the suction head 165a are components that meet the standard, and the electronic componentsD2 of the suction head 165 b are components that do not meet thepredetermined standard. In such a case, at a time t7, the suction heads165 a, 165 b move above the trays T1, T2 for the already-inspectedcomponents, respectively. Thereafter, the suction heads 165 a, 165 bmove up, and thus, the electronic components D1, D2 are stored in thetrays T1, T2 for the already-inspected components. At this time, thesuction heads 165 a, 165 b move down, and thereafter, the electroniccomponents D1, D2 are released before they move up. As a result, theelectronic components D1, D2 are stored in the trays T1, T2 for thealready-inspected components.

If both the electronic components D1, D2 of the suction heads 165 a, 165b meet the predetermined standard, the suction head 165 a (or thesuction head 165 b) on one side is located above the tray T1 and ismoved down. Then, the electronic component D1 is released, andthereafter, the suction head 165 a is moved up. Thereafter, the suctionhead 165 b (or the suction head 165 a) on the other side is locatedabove the tray T1, and then, the electronic component D2 is released. Atthis time, the suction head 165 b on the other side moves in the X-axisdirection, and at the same time, the suction head 165 a on the one sideis allowed to retreat in the X-axis direction from above the tray T1. Asa result, the suction heads are prevented from interfering with eachother.

On the other hand, if the electronic components D1 of the suction head165 a are components that do not meet the predetermined standard, andthe electronic components D2 of the suction head 165 b are componentsthat meet the predetermined standard, then the suction head 165 a on theone side is located above the tray T2 and is moved down. Then, theelectronic component D1 is released, and thereafter, the suction head165 a is moved up. Thereafter, the suction head 165 b on the other sideis located above the tray T1, and then in the same way, the electroniccomponent D2 is released. Hence, when the suction head 165 b on theother side is set above the tray T1, in order to prevent it frominterfering with the suction head 165 a on the one side, the suctionhead 165 a is moved in the negative X-axis direction.

(7) Time t8 to t10

At a time t8, the suction heads 165 a, 165 b start to move in thepositive X-axis direction toward the tray T4 for components that havenot yet been inspected. At this time, the suction head 165 b moves to areference position in the Y-axis direction and in the R direction.Simultaneously, the Y-direction tray transfer mechanism 180 operates tomove the tray T4 in the Y-axis direction. A reference position Y0 in theY-axis direction is preferably the middle point between the componentposition confirmation cameras 151 a, 151 b, and is shown as Y0 in FIGS.17 to 24.

(8) Time t10 to t12 (see FIG. 21)

At a time t10, the suction head 165 b on one side reaches up to abovethe tray T3.

Thereafter, the suction head 165 b moves down, and comes into contactwith, or close to, the upper surface of an electronic component D6 whichis stored in the tray T3. Then, the suction head 165 b suctions andpicks-up the electronic component D6. As a result, the electroniccomponent D6 is removed from the tray T3, while continuing to besuctioned and held by the suction head 165 b.

From a time t10 b, the suction heads 165 a, 165 b move in the positiveX-axis direction. Then, at a time t1, the suction head 165 a on theother side reaches up to above the tray T3. Then, between the time t11and a time t12, in the same way as with the case of the suction nozzle166 b on the other side, an electronic component D5 is suctioned andpicked-up by the suction nozzle 166 a. At the time t12, the suction head165 a starts to move in the positive X-axis direction toward theinspection socket 152 a.

(9) Time t13 to t15 (see FIG. 22)

While moving in the X-axis direction, the suction heads 165 a, 165 bmove in the positive Y-axis direction. This movement in the Y-axisdirection is made to prevent the suction heads from interfering witheach other within the head interference area Ai. Thus, this movement ismade before the suction heads 165 a, 165 b come into the headinterference area Ai.

Thereafter, while the suction heads 165 a, 165 b are moving in theX-axis direction, they pass above the component position confirmationcamera 151 a. Specifically, the suction heads 165 b, 165 a pass, in thisorder, above the component position confirmation camera 151 a. When theypass, an image is captured by the component position confirmation camera151 a. Based upon the captured image information, the position of theelectronic components D5, D6 (i.e., the position relative to the suctionheads 165 a, 165 b, the suction state of the electronic components D5,D6) is recognized.

(10) Time t15 to t16

Based upon the position of the electronic components D5, D6 that haveundergone the image recognition, while moving in the X-axis direction,the position of the suction heads 165 a, 165 b in the Y-axis directionand in the R direction is rectified (or corrected). This helps toreliably connect the electronic components D5, D6 to the inspectionsockets 152 a, 152 b. Specifically, when the electronic components D5,D6 are stored in the tray T3, the position in which they are placed maybe shifted, or such a problem may take place. This may produce an errorwhen they are suctioned and picked up. However, the above-describedprocessing prevents such an error from being made.

(11) Time t17 to t18 (see FIG. 23)

At a time t17, the movement of the suction heads 165 a, 165 b in theX-axis direction is completed. In addition, the inspection of theelectronic components D3, D4 is completed.

During the period of the time t17 to a time t18, the suction heads 165c, 165 d suction/pick-up the electronic components D3, D4, and moveupward.

(12) Time t18 to t19 (see FIG. 24)

The suction heads 165 a, 165 b and the suction heads 165 c, 165 d moveall together in the negative Y-axis direction. Consequently, the suctionheads 165 a, 165 b are located above the inspection sockets 152 a, 152b. At this time, the position of the suction heads 165 a, 165 b iscorrected during the time t15 to t16, and thus, the electroniccomponents D5, D6 are put in a suitable position (i.e., upward) so thatthey can be connected to the inspection sockets 152 a, 152 b.

(13) Time t19 to t20

The suction heads 165 a, 165 b move down, and the electronic componentsD5, D6 are connected to the inspection sockets 152 a, 152 b. Thereafter,at a time t20, an inspection of the electronic components D5, D6 starts.An operation here is basically the same as in the case during the timet3 to t4, except for the fact that the role of the suction heads 165 a,165 b is replaced by that of the suction heads 165 c, 165 d.

(14) After Time t20

From this time on, the inspection of the electronic components D5, D6continues. Then, except for the fact that the role of the suction heads165 a, 165 b is replaced by that of the suction heads 165 c, 165 d, theoperations which correspond to those after the time t4 are repeated andcontinued.

In the above-described operations of the electronic component inspectionapparatus 1A, the case has been described in which the inspectionsockets 152 are preferably arranged in the X-axis direction. Butdescriptions are omitted regarding how the direction in which theinspection plate 153 is attached is detected, and based on the detectedattachment direction, how the position of the suction head 165 iscontrolled. As a practical matter, however, the type of the inspectionsocket 152 and the attachment direction are detected by theinspection-position confirmation camera 154, the opening detectionportion 156 or other suitable elements. Thereafter, in response to thetype of the inspection socket 152 and the attachment direction that beendetected, the suction head 165 (165 a to 165 d) are moved. As a result,at the times t3, t19, the suction head 165 is located above theinspection sockets 152 a, 152 b.

It is sufficient that the type of the inspection socket 152 and theattachment direction are detected only once when the electroniccomponent inspection apparatus 1A starts to operate.

As described above, in the electronic component inspection apparatus 1A,the component position confirmation camera 151 is preferably disposed inthe inspection area 150. Then, the electronic component D is removedfrom the tray T4 while being suctioned and held by the suction head 165.Thereafter, in this state, this electronic component D is moved to aposition above the component position confirmation cameras 151. Then,the state in which the electronic component D is suctioned and held isrecognized by its image. Next, based on this image recognition, a shiftin the suction is corrected. Then, the electronic component D isinserted into the inspection socket 152. Hence, until the electroniccomponent D is inserted into the inspection socket 152 after beingremoved from the tray T4, it is transferred while being suctioned andheld by the suction nozzle 166 and without being moved down at all.Therefore, while the electronic component D is recognized by its imageand is precisely inserted into the inspection socket 152, the electroniccomponent D can be swiftly transferred from the tray T4 to theinspection sockets 152 a, 152 b.

Particularly, the electronic component D itself, which is held by thesuction nozzle 166, is recognized by its image, thereby making itpossible to detect the suction state precisely. Thus, the electroniccomponent D can be inserted more precisely and more certainly into theinspection sockets 152 a, 152 b. Conventionally, after an electroniccomponent that has been placed is recognized by its image, theelectronic component is suctioned. In that case, if the electroniccomponent is suctioned after the image has been recognized, a shift maybe produced at that time. After that, the shift cannot be corrected,thereby preventing the electronic component from being preciselyinserted into an inspection socket. However, in the electronic componentinspection apparatus 1A according to this preferred embodiment,immediately before it is inserted into the inspection sockets 152 a, 152b, the electronic component D itself that is held by the suction nozzle166 is recognized by its image, so that the suction state can bechecked. Thus, there is no possibility that any suction shift occurslater. Therefore, the electronic component D can be inserted moreprecisely and more reliably into the inspection sockets 152 a, 152 b.

Furthermore, in the electronic component inspection apparatus 1A, eachtray T1 to T4 (the tray T1 for components that have met thepredetermined standard, the tray T2 for components that have not met thepredetermined standard, the empty tray T3, and the tray T4 forcomponents before they have been inspected) of the tray disposition area130, the inspection sockets 152 a, 152 b, and the component positionconfirmation camera 151 a (or 151 b), are arranged substantially inline. As a result, the electronic component D that has been removed fromthe tray T can be transferred almost along a straight line in the X-axisdirection. Therefore, the electronic component D can be transferred athigher speed than in any conventional such apparatus in which theelectronic component D is moved over a long distance in both the X-axisdirection and the Y-axis direction. Beside, the tray disposition area130 and the like are arranged along a line in the X-axis direction, thusmaking the layout of the tray disposition area 130 much more compact.Especially, the electronic component inspection apparatus 1A can beprovided which has a compact configuration in the Y-axis direction.

Moreover, in the electronic component inspection apparatus 1A accordingto this preferred embodiment, the two X-axis robots 120 a, 120 b arepreferably provided. In these X-axis robots 120 a, 120 b, there ispreferably provided, respectively, the pair of components transfermechanisms 160 (i.e., the components transfer mechanisms 160 a, 160 band the components transfer mechanisms 160 c, 160 d). By the pair ofcomponents transfer mechanisms 160, the electronic component D istransferred alternately. Therefore, the electronic components D aretransferred without a break to the inspection socket 152, and thus, theelectronic components D can be consecutively inspected. This allows theelectronic components D to be inspected in an extremely effectivemanner.

FIG. 25 is a top view of an electronic component inspection apparatus 1Baccording to a second preferred embodiment of the present invention. Theelectronic component inspection apparatus 1B shown in this figurepreferably includes, as an electronic component transfer unit thattransfers the electronic components D, such an electronic componenttransfer unit 100B as described below. The electronic componentinspection apparatus 1B is preferably configured by combining theelectronic component transfer unit 100B and the electronic componentinspection unit 200.

The electronic component inspection apparatuses 1B to 10I according tothe second to ninth preferred embodiments, which will be describedhereinafter, each have a basic configuration common to the electroniccomponent inspection apparatus 1A according to the first preferredembodiment. Therefore, in the following description, the portions thatare common to those according to the first preferred embodiment aregiven the same reference characters and numerals as much as possible.Description of common portions is omitted (or simplified), and points ofdifference are described in detail.

The electronic component transfer unit 100B according to the secondpreferred embodiment preferably includes the base stand 110, the X-axisrobots 120 (120 a, 120 b), a tray disposition area 2130 (2130 a, 2130b), a stocker disposition area 2140 (2140 a, 2140 b), the inspectionarea 150, the components transfer mechanism 160 (160 a to 160 d), theX-direction tray transfer mechanism 170 (170 a, 170 b), the Y-directiontray transfer mechanism 180 (180 a to 180 d), the control portion 190,and other components, and a cover is placed over it.

According to this preferred embodiment, the base stand 110 has asubstantially U-shape at its bottom portion. The electronic componentinspection unit 200 is inserted into a space 2111 of the base stand 110from the Y-axis direction. According to this configuration where thebottom component of the base stand 110 is substantially U-shaped, thefour corners of the base stand 110 can bear the load of such a unit.Thus, even if a mechanical force (e.g., by an earthquake) is applied,the unit could not fall down easily because of its stability.

Near the middle of the base stand 110, the inspection area 150 islocated. As the tray disposition area 2130, the two tray dispositionareas 2130 a, 2130 b are provided such that the inspection area 150 islocated between them in the X-axis direction. As the stocker dispositionarea 2140, the two stocker disposition areas 2140 a, 2140 b are locatedso as to correspond to the tray disposition areas 2130 a, 2130 b,respectively.

According to this preferred embodiment, the trays T1 to T4 are sortedand placed at each tray disposition area 2130 a, 2130 b. The tray T4 forcomponents that have not yet been inspected is placed in an area that isdifferent from that for the trays T1, T2 for components that havealready been inspected. This prevents the not-inspected electroniccomponents D from mixing with the already-inspected electroniccomponents D.

According to this second preferred embodiment, as shown by a virtualline, the trays T1 to T4 can each be placed at both of the traydisposition areas 2130 a, 2130 b. According to this configuration, thespeed of inspections can be increased, using the four suction heads 165effectively. At this time, the electronic components D are transferredfrom the tray disposition area 2130 to the inspection area 150, andthen, they are inspected, alternately between the tray disposition areas2130 a, 2130 b. As a result, the inspection area 150 is commonly usedfor the tray disposition areas 2130 a, 2130 b, and they can beeffectively inspected. This sharing helps reduce production costs and aninstallation area for the apparatus. In this case, as the componentposition confirmation camera 151, two cameras are provided for each ofthe tray disposition area 2130 a and the tray disposition area 2130 b.

There is no need for the stocker 141 to have the same configuration inboth of the stocker disposition areas 2140 a, 2140 b. For example, wherethe stocker 141 should be placed on a level, and which the stocker 141should be placed, over or under the base stand 110 (i.e., in whichdirection the trays T should be piled), may also be varied according tothe stocker disposition areas 2140 a, 2140 b. A configuration where thestocker 141 is placed under the base stand 110 will be described indetail according to the preferred embodiment mentioned later.

According to the present preferred embodiment, as the X-axis robot 120,two robots are preferably used, but only a single X-axis robot 120 mayalso be used (e.g., the X-axis robot 120 a). In that case, in the X-axisrobot 120 a, two components transfer mechanisms 160 a, 160 b arearranged so as to be moved. According to this configuration, the twocomponents transfer mechanisms 160 on the X-axis robot 120 a can beefficiently used, thus making inspections efficient.

In addition, in a single X-axis robot 120 (e.g., the X-axis robot 120a), the four components transfer mechanisms 160 a to 160 d may also beplaced. In that case, by the components transfer mechanisms 160 a, 160b, the electronic components D are transferred between the traydisposition area 2130 a and the inspection area 150. Then, by thecomponents transfer mechanisms 160 c, 160 d, the electronic components Dare transferred between the tray disposition area 2130 b and theinspection area 150. This makes it possible to inspect the electroniccomponents D efficiently. In this case, as the component positionconfirmation camera 151, it is sufficient that one camera is providedfor each of the tray disposition area 2130 a and the tray dispositionarea 2130 b.

FIG. 26 is a top view of an electronic component inspection apparatus 1Caccording to a third preferred embodiment of the present invention. Theelectronic component inspection apparatus 1C shown in this figurepreferably includes, as an electronic component transfer unit thattransfers the electronic components D, such an electronic componenttransfer unit 100C as described below. The electronic componentapparatus 1C is preferably configured by combining the electroniccomponent transfer unit 100C and the electronic component inspectionunit 200.

In the electronic component transfer unit 100C shown in this figure, thetwo tray disposition areas 2130 a, 2130 b are arranged such that theinspection area 150 is located between them in the X-axis direction. Thetwo stocker disposition areas 2140 a, 2140 b are arranged correspondingto the tray disposition areas 2130 a, 2130 b. In this respect, itsconfiguration is similar to that of the electronic component inspectionapparatus 1B shown in FIG. 25. However, in the following points, it isdifferent in configuration from the electronic component inspectionapparatus 1B shown in FIG. 25.

Specifically, in the X-axis robots 120 a, 120 b on one side, there areplaced four components transfer mechanisms 160 a, 160 b and 160 e, 160f. Similarly, in the X-axis robots, 120 a, 120 b on the other side,there are placed four components transfer mechanisms 160 c, 160 d and160 g, 160 h. Among the components transfer mechanisms 160 a, 160 b and160 e, 160 f which are placed in the X-axis robot 120 a on the one side,in the components transfer mechanisms 160 a, 160 e at both outside areas(i.e., at both outside areas in the positive and negative X-axisdirections), X-direction tray transfer mechanisms 170 a, 170 c aredisposed, respectively. On the other hand, among the components transfermechanisms 160 c, 160 d and 160 g, 160 h which are placed in the X-axisrobot 120 b on the other side, in the components transfer mechanisms 160c, 160 g at both outside areas, X-direction tray transfer mechanisms 170b, 170 d are disposed, respectively. In addition, among the componentstransfer mechanisms 160 a, 160 b and 160 e, 160 f which are placed inthe X-axis robot 120 a on the one side, in each of the componentstransfer mechanisms 160 b, 160 f on the inside, the inspection-positionconfirmation camera 154 is disposed.

In each tray disposition area 2130 a, 2130 b, the trays T1 to T4 aredisposed. In the stocker disposition areas 2140 a, 2140 b, the stockers141 a to 141 d and stockers 141e to 141h are disposed, respectively.

In the inspection area 150, a pair of inspection plates 153 a, 153 beach of which includes the inspection sockets 152 a, 152 b are disposedadjacent to each other in the X-axis direction. Between the inspectionplate 153 a on one side and the tray disposition area 2130 a on oneside, the component position confirmation cameras 151 a, 151 b aredisposed. Between the inspection plate 153 b on the other side and thetray disposition area 2130 b on the other side, component positionconfirmation cameras 151 c, 151 d are disposed.

In other words, in the electronic component inspection apparatus 1C, theelectronic component D is inspected while the electronic component D isbeing transferred between the tray disposition area 2130 a on the oneside and the inspection socket 152 on the one side, using the componentstransfer mechanisms 160 a, 160 b and 160 c, 160 d. On the other hand,apart from this, the electronic component D is inspected while theelectronic component D is being transferred between the tray dispositionarea 2130 b on the other side and the inspection socket 152 on the otherside, using the components transfer mechanisms 160 e, 160 f and 160 g,160 h.

The electronic component inspection apparatus 1C includes double theconfiguration of the electronic component inspection apparatus 1Aaccording to the first preferred embodiment. This makes it possible toinspect the electronic component D more efficiently.

According to the configuration of the electronic component inspectionapparatus 1C according to the third preferred embodiment, the componentstransfer mechanisms 160 a, 160 b and 160 c, 160 d are placed in theX-axis robot 120 a on the one side, and the components transfermechanisms 160 e, 160 f and 160 g, 160 h are placed in the X-axis robot120 b on the other side, respectively. However, for example, as shown inFIG. 27, the components transfer mechanisms 160 a, 160 b, the componentstransfer mechanisms 160 c, 160 d, the components transfer mechanisms 160e, 160 f, and the components transfer mechanisms 160 g, 160 h, may alsobe placed in individual X-axis robots 120 a-1, 120 a-2, 120 b-1, 120b-2, respectively.

FIG. 28 is a top view of an electronic component inspection apparatus 1Daccording to a fourth preferred embodiment of the present invention. Theelectronic component inspection apparatus 1D shown in this figureincludes, as an electronic component transfer unit that transfers theelectronic components D, such an electronic component transfer unit 100Das described below. The electronic component inspection apparatus 1D ispreferably configured by combining the electronic component transferunit 100D and the electronic component inspection unit 200.

The electronic component transfer unit 100D preferably includes the basestand 110, the two X-axis robots 120 a, 120 b, the tray disposition area130, the stocker disposition area 140, the inspection area 150,components transfer mechanisms 3160 a, 3160 b, an X-direction traytransfer mechanism 3170, the Y-direction tray transfer mechanism 180 ato 180 d, a control portion, and other elements.

FIG. 29 and FIG. 30 are an enlarged top view and side view of thecomponents transfer mechanism 3160 (3160 a, 3160 b).

As shown in the same figures, according to this preferred embodiment,the components transfer mechanisms 3160 a, 3160 b each includes, as itsbase, a Y-axis robot 3162 which extends between both X-axis robots 120a, 120 b. More specifically, each of the components transfer mechanisms3160 a, 3160 b preferably includes a pair of X-direction drive portions3161 which are provided in each X-axis robot 120 a, 120 b, the Y-axisrobot 3162 which is supported across these X-direction drive portions3161, a Z-direction drive portion 3163 which is moved in the Y-axisdirection by the Y-axis robot 3162, an R-direction drive portion 3165which is connected to the Z-direction drive portion 3163, a suction headbody 3166 which is connected to the R-direction drive portion 3165, asuction-nozzle support member 3167 which is connected to the suctionhead body 3166, a suction nozzle 3168, and other suitable elements.

Each X-direction drive portion operates to move the Y-axis robot 3162 inthe Y-axis direction. On the other hand, the Y-axis robot 3162 operatesto move the Z-direction drive portion 3163 and the like in the Y-axisdirection. As a result, the suction nozzle 3168 is moved in the X-axisand Y-axis directions. Then, the Z-direction drive portion 3163 and theR-direction drive portion 3165 operate to move (i.e., lift) the suctionnozzle 3168 in the Z-axis direction, and to rotate the suction nozzle3168 about the R axis.

With respect to the components transfer mechanisms 3160 a, 3160 b, inthe components transfer mechanism 3160 a on one side, the X-directiontray transfer mechanism 3170 is provided and has the same configurationas the X-direction tray transfer mechanism 170 according to the firstpreferred embodiment. In the suction head body 3166 of the componentstransfer mechanism 3160 b on the other side, the inspection-positionconfirmation camera 154 is provided.

The inspection plate 153 is disposed in the inspection area 150, whichincludes the inspection sockets 152 a, 152 b. But between the inspectionplate 153 and the tray disposition area 130, as the component positionconfirmation camera 151, only one camera is preferably provided (seeFIG. 13A).

As described above, the electronic component transfer unit 100D isprovided with the components transfer mechanisms 3160 a, 3160 b, whichinclude a combination of the X-axis robots 120 a, 120 b, the Y-axisrobot 3162 and other suitable elements. By combining such an electroniccomponent transfer unit 100D and the electronic component inspectionunit 200, an electronic component inspection apparatus 1D can beconfigured.

FIG. 31 is a top view of an electronic component inspection apparatus 1Eaccording to a fifth preferred embodiment of the present invention. Theelectronic component inspection apparatus 1E shown in this figureincludes, as an electronic component transfer unit that transfers theelectronic components D, such an electronic component transfer unit 100Eas described below. The electronic component inspection apparatus ispreferably configured by combining the electronic component transferunit 100E and the electronic component inspection unit 200.

In the electronic component transfer unit 100E shown in this figure, thetwo tray disposition areas 2130 a, 2130 b are arranged such that theinspection area 150 is located between the min the X-axis direction. Thestocker disposition areas 2140 a, 2140 b are arranged so as tocorrespond to these tray disposition areas 2130 a, 2130 b.

Similar to the fourth preferred embodiment, four components transfermechanisms 3160 a to 3160 d are arranged to extend between the X-axisrobots 120 a, 120 b. Among these components transfer mechanisms 3160 ato 3160 d, in each of the components transfer mechanisms 3160 a, 3160 cdisposed at both outer areas, the X-direction tray transfer mechanism3170 is provided. On the other hand, in each of the components transfermechanisms 3160 b, 3160 d at the inner areas, the inspection-positionconfirmation camera 154 is provided. The basic configuration of theX-direction tray transfer mechanism 3170 is preferably the same as thatof the X-direction tray transfer mechanism 170 according to the firstpreferred embodiment.

The trays T1 to T4 are disposed in each tray disposition area 2130 a,2130 b. In the stocker disposition areas 2140 a, 2140 b, stockerdisposition areas 141 a to 141 d and 141 e to 141 h, are disposed,respectively.

In the inspection area 150, the pair of inspection plates 153 a, 153 beach of which includes the inspection sockets 152 a, 152 b are disposedadjacent to each other in the X-axis direction. Between each inspectionplate 153 a, 153 b and the tray disposition areas 2130 a, 2130 b at theouter portions thereof (i.e., at the outer areas in the Y-axisdirection) the component position confirmation camera 151 is disposed,respectively.

In other words, in the electronic component inspection apparatus 1E, asdescribed above, including the components transfer mechanisms 3160 a,3160 b extending between the X-axis robots 120 a, 120 b, the electroniccomponent D is inspected while the electronic component D is beingtransferred between the inspection plate 153 a on the one side and thetray disposition area 2130 a.

On the other hand, apart from this, using the components transfermechanisms 3160 c, 3160 d, the electronic component D is inspected whilethe electronic component D is being transferred between the inspectionplate 153 b on the other side and the tray disposition area 2130 b.

The electronic component inspection apparatus 1E includes double theconfiguration of the electronic component inspection apparatus 1Daccording to the fourth preferred embodiment. This makes it possible toinspect the electronic component D more efficiently than in theelectronic component inspection apparatus 1D according to the fourthpreferred embodiment.

FIG. 32 is a perspective view of an electronic component inspectionapparatus 1F according to a sixth preferred embodiment of the presentinvention. The electronic component inspection apparatus 1F shown inthis figure includes, as an electronic component transfer unit thattransfers the electronic components D, such an electronic componenttransfer unit 100F as described below. The electronic componentinspection apparatus 1F is preferably configured by combining theelectronic component transfer unit 100F and the electronic componentinspection unit 200.

In the electronic component inspection apparatus 1F according to thesixth preferred embodiment, each stocker 4141 (or 4141 a to 4141 d) ofthe stocker disposition area 140 is disposed below the base stand 110.This helps lower the electronic component inspection apparatus 1F, andin this respect, it is different in configuration from the electroniccomponent inspection apparatus 1A according to the first preferredembodiment. This will be described in detail below. The stockers 4141 ato 4141 d each preferably have the same configuration, and thus, in thefollowing description, each stocker 4141 a to 4141 d is notdistinguished and thus is explained with reference to the stocker 4141,unless they should especially be distinguished.

FIG. 33 and FIG. 34 are a side view and a front view of the electroniccomponent inspection apparatus 1F, seen from the X and Y-axis directionsin FIG. 32, respectively. FIG. 35 and FIG. 36 are a side view and afront view of the configuration of the stocker 4141, respectively.

The stocker 4141 preferably includes a lid portion 4142, four struts4143, a bottom portion 4144, four tray separation hooks 4145, and a traylift mechanism 4146. Inside of the stocker 4141, atray-transfer-mechanism entry region 4147 is formed and arranged suchthat the Y-direction tray transfer mechanism 180 can enter. The lidportion 4142, the upper portion of the struts 4143, the tray separationhooks 4145 and the tray-transfer-mechanism entry region 4147 aredisposed above (or on the upper portion of) the upper surface of thebase stand 110. The lower portion of the struts 4143, the bottom portion4144 and the tray lift mechanism 4146 are disposed below (or on thelower portion of) the upper surface of the base stand 110.

The lid portion 4142 has an outside appearance of a substantiallyrectangular parallelepiped shape, and its lower portion is opened. Thelid portion 4142 has the tray-transfer-mechanism entry region 4147inside, and in its side plane on the side of the tray disposition area130, it has an opening that leads to the tray-transfer-mechanism entryregion 4147. In addition, the two pairs of tray separation hooks 4145are connected to it.

The strut 4143 is connected to each of the four corners of the lidportion 4142. The strut 4143 preferably is a pillar which has asubstantially L-shape section and corresponds to each of the fourcorners of the tray T and holds the tray T in the X-axis direction andthe Y-axis direction.

The bottom portion 4144 is connected to the strut 4143, and preferablyincludes a bottom plate that preferably has a substantially rectangularshape, and four side plates. The side plates may also be excluded, andin that case, the struts 4143 are connected directly to the bottom platewhich is the bottom portion 4144.

The tray separation hooks 4145 are disposed in the lid portion 4142 onthe opposite sides to each other of the tray T, so as to hold the tray Tinside of the tray-transfer-mechanism entry region 4147. The trayseparation hook 4145 is inserted into the concave portion of the tray T,so that the tray T can be held. A drive mechanism (not shown) isconnected to the tray separation hooks 4145, and the tray separationhooks 4145 are inserted into the concave portions on the sides of thetray T and are removed from them. By the insertion and removal, the trayT is fixed and removed.

The tray lift mechanism 4146 has a flat plate (or a tray placementplate) which the trays T that are piled are placed on, and that can bemoved up and down. The flat plate is a mechanism that lifts and lowersthe piled trays T inside of the stocker 4141.

The tray-transfer-mechanism entry region 4147 is a space that preferablyhas a substantially rectangular parallelepiped shape that is set insideof the lid portion 4142. The Y-direction tray transfer mechanism 180moves into it and out of the tray-transfer-mechanism entry region 4147,from the positive Y-axis direction, through the opening on the side ofthe lid portion 4142.

An operation for the movement of the tray T from the inside of thestocker 4141 to the tray disposition area 130 will be described usingthe illustrations in FIGS. 37A-37C.

(1) First, the tray lift mechanism 4146 operates to lift the trayplacement plate. Then, within the tray-transfer-mechanism entry region4147, the uppermost tray T is set to a height position that correspondsto the tray separation hooks 4145 (see FIG. 37A). The Y-direction traytransfer mechanism 180 is kept outside of the tray-transfer-mechanismentry region 4147.

(2) The tray lift mechanism 4146 operates to fix the uppermost tray Twithin the tray-transfer-mechanism entry region 4147.

(3) The tray lift mechanism 4146 operates to move the tray placementplated down. As a result, the piled trays descend together, and only thetray T that is fixed to the tray separation hooks 4145 is held withinthe tray-transfer-mechanism entry region 4147 (see FIG. 37B).

(3) The Y-direction tray transfer mechanism 180 moves into thetray-transfer-mechanism entry region 4147. Then, the tray separationhooks 4145 is removed, and the tray T is placed onto the Y-directiontray transfer mechanism 180 (see FIG. 37C).

In this way, the tray T that has been placed on the Y-direction traytransfer mechanism 180 is fixed to the tray placement portion 183. Then,the Y-direction tray transfer mechanism 180 retreats from thetray-transfer-mechanism entry region 4147. As a result, the tray T istransferred from the tray-transfer-mechanism entry region 4147, and isplaced in the tray disposition area 130.

On the other hand, the movement and placement of the tray T from thetray disposition area 130 to the inside of the stocker 4141 is performedas described below.

(1) First, with the tray T kept in its place on the Y-direction traytransfer mechanism 180, the Y-direction tray transfer mechanism 180moves into the tray-transfer-mechanism entry region 4147 from the traydisposition area 130. Thereby, the tray T is transferred to the insideof the stocker 4141 (see FIG. 37C).

(2) The state is removed in which the tray T is fixed by the tray fixingportions 184 of the Y-direction tray transfer mechanism 180. Then, thetray separation hooks 4145 operate to fix the tray T. Thereafter, theY-direction tray transfer mechanism 180 comes out of thetray-transfer-mechanism entry region 4147 (see FIG. 37B).

(3) The tray lift mechanism 4146 operates to move the, tray placementplate up. Then, when the trays T that are piled on the tray placementplate come into contact with the bottom surface of the tray T, which isfixed by the tray separation hooks 4145, the tray separation hooks 4145are removed. As a result, all the trays T inside of the stocker 4141 areplaced on the tray placement plate of the tray lift mechanism 4146 (seeFIG. 37A).

(4) The tray lift mechanism 4146 operates to move the tray placementplate down. As a result, the piled trays T move down all together insideof the stocker 4141.

In such a manner as described above, the tray T on the tray dispositionarea 130 is placed in the uppermost portion inside of the stocker 4141.

In such a manner as described above, in the electronic componentinspection apparatus 1F according to the sixth preferred embodiment, thecomponent which protrudes above the base stand 110 can be kept down.Thus, there is an advantage in that the electronic component inspectionapparatus 1F can be made lower and more compact.

FIG. 38 is a perspective view of an electronic component inspectionapparatus 1G according to a seventh preferred embodiment of the presentinvention. The electronic component inspection apparatus 1G shown inthis figure includes, as an electronic component transfer unit thattransfers the. electronic components D, such an electronic componenttransfer unit 100G as described below. The electronic componentinspection apparatus 1G is preferably configured by combining theelectronic component transfer unit 100G and the electronic componentinspection unit 200.

In the electronic component inspection apparatus 1G according to theseventh preferred embodiment, a stocker 5141 is disposed in the traydisposition area 130 of the base stand 110. In other words, the traydisposition area 130 and the stocker disposition area 140 are used incommon, thereby making such an apparatus smaller. In this respect, it isdifferent in configuration from the electronic component inspectionapparatus 1A according to the first preferred embodiment. This will bedescribed in detail below. The stockers each preferably have the sameconfiguration, for example, so as to correspond to the trays T1 to T4.Thus, in the following description, the stockers are each described withreference to a stocker 5141, without distinguishing them especially.

The stocker 5141 preferably includes a lid portion 5142 (a portion ofwhich is cut off in FIG. 38), four struts 5143, a bottom portion 5144,four tray separation hooks 5145, a tray lift mechanism 5146, and othersuitable elements. Inside of the stocker 5141, a tray-transfer-mechanismentry region 5147 is provided and arranged to allow the Y-direction traytransfer mechanism 180 to enter. The lid portion 5142, the upper portionof the struts 5143, the tray separation hooks 5145 and thetray-transfer-mechanism entry region 5147 are disposed above (or on theupper portion of) the upper surface of the base stand 110. The lowerportion of the struts 5143, the bottom portion 5144 and the tray liftmechanism 5146 are disposed below (or on the lower portion of) the uppersurface of the base stand 110.

According to this preferred embodiment, the lid portion 5142 ispreferably defined mainly by two side plates. Both its upper and lowerportions, and both sides in the Y-axis direction, are opened. The lidportion 5142 has a tray-transfer-mechanism entry region 5147 inside. Inaddition, two pairs of tray separation hooks 5145 are provided.

The lid portion 5142 is opened upward so that the components transfermechanisms 160 can pick up and release the electronic component D fromand to the tray T inside from the lid portion 5141 (i.e., within thetray-transfer-mechanism entry region 5147). The tray T is fixed byeither the Y-direction tray transfer mechanisms 180 or the trayseparation hooks 5145. In this state, the electronic components D aresuctioned/picked up and released.

The tray T can be transferred in the X-axis direction by the X-directiontray transfer mechanism 170. This is the same as in the first to sixthpreferred embodiments.

According to this preferred embodiment, the suction head 166 has accessto an area above the uppermost tray T (because the lid portion 5142 isopened upward). Therefore, the trays T that are kept stored and piled inthe stocker 5141 can be used in that state, and the electroniccomponents D can be inspected.

In the electronic component inspection apparatus 1G according to theseventh preferred embodiment, as described above, the stockerdisposition area 140 can be used in common with the tray dispositionarea 130. This presents an advantage in that the electronic componentinspection apparatus 1G becomes more compact.

According to the present preferred embodiment, the stocker 5141 ispreferably disposed below the base stand 110. However, a stocker mayalso be disposed above the base stand 110. In that case, the lowermosttray T is moved down and placed over the tray disposition area 130.

FIG. 39 is a perspective view of an electronic component inspectionapparatus 1H according to an eighth preferred embodiment of the presentinvention. The electronic component inspection apparatus 1H shown inthis figure includes, as an electronic component transfer unit thattransfers the electronic component D, such an electronic componenttransfer unit 100H as described below. The electronic componentinspection apparatus 1H is preferably configured by combining theelectronic component transfer unit 11 0H and the electronic componentinspection unit 200.

In the electronic component inspection apparatus 1H according to theeighth preferred embodiment, a stocker 6141 stores the trays T at eachof its upper and lower portions. Thereby, the trays T can be storedefficiently. In this respect, it is different in configuration from theelectronic component inspection apparatus 1A according to the firstpreferred embodiment. This will be described in detail below. Fourstockers are disposed in the stocker disposition area 140. However, inthe following description, each stocker is described with reference tothe stocker 6141, without distinguishing them especially.

The stocker 6141 preferably includes a lid portion 6142, four struts6143, a bottom portion 6144, two pairs of tray separation hooks 6145 a,6145 b, and a tray lift mechanism 6146. Inside of the stocker 6141, atray-transfer-mechanism entry region 6147 is provided and arranged suchthat the Y-direction tray transfer mechanism 180 can enter. The lidportion 6142, the upper portions of the struts 6143, the tray separationhooks 6145 a, 6145 b and the tray-transfer-mechanism entry region 6147are disposed above (or on the upper portion of) the upper surface of thebase stand 110. The lower portions of the struts 6143, the bottomportion 6144 and the tray lift mechanism 6146 are disposed below (or onthe lower portion of) the upper surface of the base stand 110.

The trays T are stored in the upper and lower portions of the stocker6141. The trays T that are stored in the upper portion are fixed by thetray separation hooks 6145 a. The trays T that are stored in the lowerportion are placed on a tray placement plate of the tray lift mechanism6146.

The lid portion 6142 has an external shape of a substantiallyrectangular parallelepiped, and it is opened downward. The lid portion6142 may also be shaped like a flat plate.

The strut 6143 is connected to each of the four corners of the lidportion 6142. The strut is preferably a pillar that has a substantiallyL-shape section and corresponds to each of the four corners of the trayT and holds the tray T in the X-axis direction and the Y-axis.

The bottom portion 6144 is connected to the strut 6143, and preferablyincludes a bottom plate that has a substantially rectangular shape, andfour side plates. These side plates may also be excluded, and in thatcase, the struts 6143 are connected directly to the bottom plate, whichis the bottom portion 6144.

The two pairs of tray separation hooks 6145 a, 6145 b are disposed upand down in the struts 6143. In each of the four struts 6143, the trayseparation hooks 6145 a, 6145 b are disposed, and thus, the eight trayseparation hooks 6145 are provided altogether in the struts 6143.

The tray separation hooks 6145 a are disposed so as to fix the lowermosttray T on the upside in the stocker 6141. The tray separation hooks 6145a are also disposed to fix the tray T within the tray-transfer-mechanismentry region 6147.

The tray separation hooks 6145 a, 6145 b are each disposed so as tocorrespond to the sides opposite to each other of the tray T. The trayseparation hooks 6145 a, 6145 b are inserted into the concave portion ofthe tray T, so that the tray T can be prevented from falling. A drivemechanism (not shown) is connected to the tray separation hooks 6145 a,6145 b, and the tray separation hooks 6145 a, 6145 b are inserted intothe concave portions on the sides of the tray T and are removed fromthem. Through the insertion and removal, the tray T is fixed and removedin the Z direction.

The tray lift mechanism 6146 has a flat plate (or a tray placementplate) which the trays T that are piled are placed on, and that can bemoved up and down. The tray lift mechanism 6146 is a mechanism thatlifts and lowers the piled trays T inside of the stocker 6141.

The tray-transfer-mechanism entry region 6147 is a space which has asubstantially rectangular parallelepiped shape that is set between thetrays T on the upside and downside. The Y-direction tray transfermechanism 180 is arranged to enter and exit the tray-transfer-mechanismentry region 6147, from the positive Y-axis direction.

An operation for the movement of the tray T from the upper portion ofthe stocker 6141 to the tray disposition area 130 will be describedusing the illustrations in FIGS. 40A-40D.

(1) First, the tray lift mechanism 6146 operates to. lift the trayplacement plate. Then, the uppermost tray T that is placed over the trayplacement plate comes into contact with the bottom surface of a tray T0(i.e., the lowermost tray T on the upside, the tray T0 to be moved),which is fixed by the tray separation hooks 6145 a (see FIG. 40A).

(2) The tray separation hooks 6145 a are removed, and the tray liftmechanism 6146 operates to move the trays T down by the height of onetray (i.e., move down the tray placement plate). Thereby, the tray Tthat is immediately above the tray T0 comes to the height position thatcorresponds to the tray separation hooks 6145 a.

(3) The tray separation hooks 6145 a operate to fix the tray Timmediately above the tray T0 (i.e., the tray separation hooks 6145 aare inserted into the concave portions on the sides of the tray Timmediately above the tray T0) (see FIG. 40B).

(4) The tray lift mechanism 6146 operates to move the tray T0 down. Atthis time, the tray T immediately above the tray T0 is fixed by the trayseparation hooks 6145 a.

Thereafter, the tray lift mechanism 6146 operates to move the tray T0 tothe height position that corresponds to the tray separation hooks 6145b, or into the tray-transfer-mechanism entry region 6147.

(5) The tray separation hooks 6145 b operate to fix the tray T0.Thereafter, the tray lift mechanism 6146 operates to move the trayplacement plate down. As a result, only the tray T0 is fixed by the trayseparation hooks 6145 b, and the other trays are separated from the trayT0. In this state, the other trays are located both on an upside anddownside of the stocker 6141, with both kept piled (see FIG. 40C).

(6) The Y-direction tray transfer mechanism 180 moves into thetray-transfer-mechanism entry region 6147. Then, the tray separationhooks 6145 b are removed. As a result, the tray T0 is placed on theY-direction tray transfer mechanism 180 (see FIG. 40D). Then, theY-direction tray transfer mechanism 180 retreats from thetray-transfer-mechanism entry region 6147. As a result, the tray T0 iscarried out from the inside of the stocker 6141, and is placed in thetray disposition area 130.

On the other hand, the movement and placement of the tray T from thetray disposition area 130 to the upper portion of the stocker 6141 areperformed as described below.

(1) First, the tray T0 to be moved is placed on the Y-direction traytransfer mechanism 180. In this state, the Y-direction tray transfermechanism 180 moves into the tray-transfer-mechanism entry region 6147from the tray disposition area 130. Thereby, the tray T0 is transferredinto the stocker 6141 (see FIG. 40D).

(2) The fixing of the tray T0 by the Y-direction tray transfer mechanism180 is removed. On the other hand, the tray T0 is fixed by the trayseparation hooks 6145 b. Thereafter, the Y-direction tray transfermechanism 180 retreats from the tray-transfer-mechanism entry region6147 (see FIG. 40C).

(3) The tray lift mechanism 6146 operates to lift the tray placementplate. Then, the uppermost tray T is brought to the height position inwhich it comes into contact with the bottom surface of a tray T0. As aresult, all the trays T are held by the tray lift mechanism 6146. Inthis state, the tray separation hooks 6145 b are removed (see FIG. 40B).

(4) The tray lift mechanism 6146 operates to move the trays T up by theheight of one tray. As a result, the tray T0 comes to the heightposition that corresponds to the tray separation hooks 6145 a.

(5) The tray separation hooks 6145 a operate to fix the tray T that isplaced over the tray lift mechanism 6146 (see FIG. 40A). In this way,the tray T0 in the tray disposition area 130 is stored and fixed in thelowermost portion on the upside of the stocker 6141.

(6) The tray lift mechanism 6146 operates to move the tray placementplate down. At this time, the tray T0 is fixed by the tray separationhooks 6145 a. As a result, it is held as it is, even though the trayplacement plate descends.

In such a manner as described above, the tray T in the tray dispositionarea 130 is stored and fixed in the lowermost portion on the upside ofthe stocker 6141.

The tray T is stored in and removed from the lower portion of thestocker 6141, in the same way as according to the sixth preferredembodiment.

In the electronic component inspection apparatus 1H according to theeighth preferred embodiment, the tray T can be inserted into and removedfrom both portions above and below the tray-transfer-mechanism entryregion 6147 in the stocker 6141. Hence, there is an advantage in thatsuch a space can be used more efficiently.

FIG. 41 and FIG. 42 are schematic views of an electronic componentinspection apparatus 1I according to a ninth preferred embodiment of thepresent invention. FIG. 41 is a perspective view and FIG. 42 is a planview, and each of them shows the electronic component inspectionapparatus 1I.

The electronic component inspection apparatus 1I shown in this figureincludes, as an electronic component transfer unit that transfers theelectronic component D, such an electronic component transfer unit 100Ias described below. The electronic component inspection apparatus 1I isconfigured preferably by combining the electronic component transferunit 100I and the electronic component inspection unit 200 (not shown).Although the basic configuration according to the ninth preferredembodiment is similar to the electronic component inspection apparatus1A according to the first preferred embodiment, there are a large numberof differences in the specific configurations. Thus, the referencecharacters and numerals in the figures are not necessarily common tothose according to the first preferred embodiment. Some of thecomponents that are common to those according to the first preferredembodiment are described again here.

As shown in these figures, there are three areas on the base stand 110of the electronic component transfer unit 100I. Specifically, there arean inspection area Ta in which electronic components are inspected, acomponents supply-and-discharge area Sa in which components before theyare inspected are supplied and components after they have already beeninspected (or components that do meet a predetermined standard) aredischarged, and a tape component area Pa (hereinafter, referred tosimply as the component area Pa) in which already-inspected components(or components that meet the predetermined standard) are stored in atape for a tape feeder. As shown in the same figures, these areas Ta,Sa, Pa are arranged in line in the X-axis direction (i.e., in theexample shown in the figures, in the order of the areas Ta, Sa, Pa inline from the right-hand side of the apparatus). On the base stand 110,a component transferring device 1000 is further disposed which transfersthe components over the areas Ta, Sa, Pa.

The component transferring device 1000 preferably includes a pair ofrail members 11 a, 11 b which are parallel to each other and spaced fromeach other by a certain distance in the Y-axis direction, and thatextends over the areas Ta, Sa, Pa in the X-axis direction, and a pair ofhead units 12 a, 12 b (hereinafter, referred to as the first head unit12 a, the second head unit 12 b) attached to the rail members 11 a, 11b, respectively, and that can move in the Y-axis direction.

The head units 12 a, 12 b, preferably include a pair of heads 13, 14each of which includes a nozzle for suctioning and picking up components(or the suction nozzle 16 as in FIG. 43), and a head 15 used for a traywhich includes a nozzle for suctioning a tray (not shown), respectively.The tray head 15 is a member that corresponds to the X-direction traytransfer mechanism 170 according to the first preferred embodiment.

The heads 13 to 15 of each head unit 12 a, 12 b face each other and arearranged in line in the X-axis direction inside of the rail members 11a, 11 b. Each head 13 to 15 can move in the Y-axis direction, relativeto the body component of the head units 12 a, 12 b. The other heads 14,15 can move in the X-axis direction relative to the one head 13.According to this configuration, each head 13 to 15 can move in theX-axis and Y-axis directions, relatively in the head units 12 a, 12 b.The suction nozzle 16 can move up (i.e., move in the Z-axis direction)and rotate (i.e., turn around the Z axis) with respect to each of theheads 13, 14.

In the inspection area Ta, there are disposed the inspection plate 153which includes a pair of sockets (not shown), and the component positionconfirmation cameras 151 a, 151 b which capture the image of a statewhere a component is suctioned by the suction nozzle 16 of each of theheads 13, 14.

The components supply-and-discharge area Sa preferably includes twoareas. More specifically, a tray area Sa1 is provided on the side (i.e.,on the right-hand side in FIG. 42) of the inspection area Ta, and awafer area Sa2 is provided on the side of the component area Pa.

The tray area Sa1 includes an empty-tray stand by portion 31 in whichthe tray T (i.e., the empty tray T3) for storing components stands by, astocker 30 in which the empty trays T3 that are supplied to theempty-tray standby portion 31 are placed while being piled, a componentstorage portion 32 in which the tray T (i.e., the tray T2) that storescomponents that have been judged not to meet a predetermined standard,is placed, and a stocker 33 in which the trays T2 that store componentsthat have been judged not to meet the predetermined standard are placedin a pile so that they can be discharged.

The empty-tray standby portion 31 and the component storage portion 32are disposed adjacent to each other in the X-axis direction on theinside of both rail members 11 a, 11 b. In contrast, the stockers 30, 33are disposed, with respect to the rail member 11 b on one side (i.e., onthe downside in FIG. 42), on the opposite side to the empty-tray standbyportion 31 and the component storage portion 32 (i.e., on the outside ofthe rail member 11 b), respectively. In other words, according to thispreferred embodiment, the empty-tray standby portion 31 of the tray areaSa1 corresponds to the tray disposition area 130 c according to thefirst preferred embodiment, the area of the component storage portion 32corresponds to the tray disposition area 130 d according to the firstpreferred embodiment, the area in which the stocker 30 is disposedcorresponds to the stocker disposition area 140 c according to the firstpreferred embodiment, and the area in which the stocker 33 is disposedcorresponds to the stocker disposition area 140 c according to the firstpreferred embodiment.

The tray area Sa1 also includes a tray movement mechanism which movesthe tray T3 which is placed in the stocker 30 to the empty-tray standbyportion 31, and a tray movement mechanism which moves, to the stocker33, the tray T2 that has stored components (i.e., components that havebeen determined not to meet the predetermined standard) that has beenplaced in the component storage portion 32.

These tray movement mechanisms (i.e., the container moving deviceaccording to various preferred embodiments of the present invention)preferably have a common configuration. Such a configuration will bedescribed below, using an example of the tray movement mechanism thatmoves the tray T between the empty-tray standby portion 31 and thestocker 30. In the following description, the tray T2 is notdistinguished from the tray T3, and thus, the trays are described as thetray T, unless they especially need to be distinguished.

As schematically shown in FIG. 43, the tray movement mechanismpreferably includes a rail member 34 which is disposed below the basestand 110 and extends in the Y-axis direction, a movement member 35which is attached to the rail member 34 so as to move, and a lift-upunit (not shown) which lifts up, from among the trays T piled on thestocker 30, the ones other than the lowermost tray T, so that thelowermost tray T can be separated from the other trays.

In the movement member 35, a hook 36 is provided which can hook the trayT from below and that can fall down. The hook 36 protrudes upward fromthe base stand, through an opening that is formed in the base stand 110and is shaped like a long and narrow slit in the Y-axis direction. Inthis protrusion state, it can hook the tray T from below.

Specifically, as shown in the same figure, the lift-up unit operates tolift up, from among the trays T piled on the stocker 30, the trays otherthan the lowermost tray T. Then, the hook 36 protrudes upward from thebase stand, and in this state, the movement member 35 is moved along therail member 34. As the movement member 35 moves, the hook 36 hooks thelowermost tray T that is placed in the empty-tray placement portion 30.Then, the tray T is pulled out from the empty-tray placement portion 30,and is moved to the empty-tray standby portion 31. After it has beenmoved, the hook 36 is switched into a falling posture (i.e., retreatsdownward from the base stand). In this state, the movement member 35 isreset to the empty-tray placement portion 30, and thereby, the tray T isleft at the empty-tray standby portion 31.

A tray movement mechanism between the component storage portion 32 and atray discharge portion 33 is omitted and is not shown in any figure.However, the tray movement mechanism has practically the sameconfiguration as described above. The tray T that lies in the componentstorage portion 32 is moved to the tray discharge portion 33, and then,it is inserted into the lowermost portion of the trays T that havealready been piled in the tray discharge portion 33.

The wafer area Sa2 includes a component standby portion 55 in which abare chip (or a chip component) as a component stands by, a cassettesetting portion 40 which sets a cassette 41 that has stored a wafer Wa,a wafer placement portion 42 which holds the wafer Wa so that it can bemoved, and a bare-chip taking-out unit 50 (i.e., the chip-componentstaking-out device) which takes out and moves a bare chip to thecomponent standby portion 55 from the wafer Wa that is placed in thewafer placement portion 42.

The component standby portion 55 is placed between the rail members 11a, 11 b. The component standby portion 55 is provided with a table 55 a,and a bare chip that is removed from the wafer Wa is placed on the table55 a in a state where it can be suctioned by the head units 12 a, 12 b.

The cassette setting portion 40 is arranged to jut out sideward (or,downward in FIG. 42) from the base stand 110. The cassette 41 which hasstored the wafers WA (i.e., the wafers on which bare chips are keptdiced) is designed to be set to the cassette setting portion 40 so thatit can be attached and detached. In the cassette setting portion 40, awafer inserting and taking-out mechanism is provided which inserts andremoves wafers into and from the cassette 41, though it is not shown inany figures. Using this mechanism, the wafers WA inside of the cassette41 are removed, and then, they are moved and placed on a stage 48(described later) of the wafer placement portion 42.

The wafer placement portion 42 is located between the rail member 11 bon one side and the cassette setting portion 40. In the wafer placementportion 42, as shown in FIG. 44, there is provided a wafer movement unit43.

The wafer movement unit 43 is placed below the base stand 110, andincludes a movable member 45 which can move along a pair of rail membersthat extends in the X-axis direction, a base member 46 which can move inthe Y-axis direction with respect to the movable member 45, and a waferplacement table 48 which is held above the base member 46 by anup-and-down movement axis 47, so that it can be moved up and down (i.e.,in the Z-axis direction). Then, the wafer Wa is supported on the table48, and in this state, the movable member 45 moves in the X-axisdirection and the base member 46 moves in the Y-axis direction. As aresult, the wafer Wa is moved along the X-Y plane (i.e.,two-dimensionally).

The bare-chip taking-out unit 50 preferably includes an elevated railmember 51 which extends from the wafer placement portion 42 to thecomponent standby portion 55 in the Y-axis direction, and a movable unit52 which can move along the rail member 51. In the movable unit 52, anup-and-down moving frame 54 is provided which can move up and downrelative to its body. A suction head 53 that includes a nozzle forsuctioning components (or a suction nozzle 53 a) is disposed in theup-and-down moving frame 54, and is held so that it can rotate aroundthe horizontal axis with respect to the up-and-down moving frame 54.

In brief, in the wafer area Sa2, the wafer Wa is removed from thecassette 41 that is set at the cassette setting portion 40. Then, it ismoved and placed onto the wafer placement table 48 of the waferplacement portion 42. Next, using the bare-chip taking-out unit 50, barechips are removed one by one to the component standby portion 55 fromthe wafer Wa on the wafer placement table 48.

Using the bare-chip taking-out unit 50, bare chips are removed asdescribed below. More specifically, as shown on the left side in FIG.45, the suction nozzle 53 a is directed downward. In this state, themovable unit 52 is put in a predetermined chip-suction position abovethe wafer placement portion 42. Thereafter, the up-and-down moving frame54 moves up and down with respect to the movable unit 52. As it moves upand down, through an opening portion 49 of the base stand 110, a barechip is picked up from the wafer Wa, while being suctioned by thesuction nozzle 53 a. At this time, the above-described wafer movementunit 43 operates to move the wafer Wa. Thereby, the bare chip to beremoved is put in the position opposite to the suction nozzle 53 a, andin the height position where it is removed. Then, the bare chip ispicked up, and thereafter, the movable unit 52 is located at thecomponent standby portion 55. As shown on the left side (or by thebroken line) in the same figure, the bare chip is placed on the table 55a, face up, in other words, in the posture where the bare chip issuctioned by the suction nozzle 16 and picked up from the wafer Wa andheld in that state. Alternatively, as shown by the solid line, thesuctioned bare chip is held above the table 55 a, face down, in otherwords, in the posture where the bare chip is held by the suction, andthe bare chip is turned over up and down by the rotation of the suctionhead 53.

In FIG. 41 and FIG. 42, reference numeral 56 denotes a chip recognitioncamera that is placed above the wafer placement portion 42. The camera56 is fixed to the base stand 110 by a support arm 57. The chiprecognition camera 56 preferably includes an image capture device suchas a CCD area sensor. In order to recognize whether or not there is amark (or a bad mark which is described later) that is written on thebare chip, it obtains and captures the image of each bare chip of thewafer Wa through the opening portion 49 of the base stand 110.

The component area Pa is an area where a tape for a tape feeder used inan apparatus that mounts electronic components is provided. Morespecifically, it is an area where an operation is performed for storingalready-inspected bare chips (i.e., up-to-standard chips) in aspecial-purpose tape. It is preferably configured as described below.

In the component area Pa, on one side (i.e., on the upside in FIG. 42)with respect to the rail members 11 a, 11 b, there is supported a reel62 around which a base tape 63 is rolled. The base tape 63 is preferablyprovided with a large number of concave portions in line that are usedto store components. On the other side opposite to the reel 62 withrespect to the rail members 11 a, 11 b, there is supported a reel 61around which a reel 60 and a product tape 61 are rolled. A cover tape iswound around the reel 60. Between both rail members 11 a, 11 b, there isprovided a component storage portion 64. The base tape 63 that isintroduced from the reel 62 passes through the component storage portion64. Then, it is led to the reel 61 and is wound up around the reel 61.Immediately before that, the cover tape is stuck on the base tape 63, sothat the openings of the concave portions are covered. In other words,in the concave portions of the base tape 63 that passes through thecomponent storage portion 64, the already-inspected bare chips (i.e.,the chips that have met the predetermined standard) are stored one afteranother. Then, the cover tape is attached, so that the concave portionsare closed.

Though it is not shown in any figure, the electronic componentinspection apparatus 10I also preferably includes the control portion190, in the same way as in the electronic component inspection apparatus1A according to the first preferred embodiment. All the operations ofthe above-described head units 12 a, 12 b and other suitable elementsare systematically controlled by the control portion 190. Hereinafter,an example of the operation of the electronic component inspectionapparatus 10I by the control portion will be described, using the flowchart in FIG. 46.

If an operation starts for an inspection, first, a decision is madewhether or not the wafer Wa has been removed from the wafer placementportion 42 (in a step S1). If the decision is made that the wafer Wa hasnot been removed, the wafer Wa is removed from the cassette 41 that isset at the cassette setting portion 40. Then, it is moved and placedonto the table 48 of the wafer movement unit 43 (in a step S2).

Next, an image of the wafer Wa that has been placed onto the table 48 isrecognized (in a step S3). More.: specifically, among the bare chipsthat have been diced, the ones that are already defective in shape dueto the manufacturing process are each given a bad mark in thepre-process. in a step S4, the wafer movement unit 43 operates to movethe wafer Wa relative to the chip recognition camera 56, and an image ofeach bare chip is captured. As a result, among the bare chips in thewafer Wa, the position (or coordinates) of a bare chip with a bad markis recognized using its image.

When the image recognition of such a bare chip is completed, the movableunit 52 is put in a predetermined chips taking-out position. The wafermovement unit 43 operates to move the wafer Wa relatively to the movableunit 52, so that a bare chip to be removed faces the suction head 53.Then, the bare chip is removed (in the step S4).

After the bare chip has been removed by the suction head 53, a decisionis made whether or not it should be turned over (in a step S5). If thedecision is made that it should not be turned over (i.e., there is noturn-over), the movable unit 52 moves to the component standby portion55. Then, the bare chip is placed face up onto the table 55 a (in a stepS6). On the other hand, if the decision is made that it should be turnedover (i.e., there is a turn-over), after the movable unit 52 moves tothe component standby portion 55, the suction head 53 rotates to placethe bare chip face down above the table 55 a (in a step S12).

Next, the first head unit 12 a (or the second head unit 12 b) is movedabove the component standby portion 55. Thereafter, the heads 13, 14operate to allow the first head unit 12 a (or the second head unit 12 b)to suction/pick-up the bare chip on the table 55 a, or the bare chipthat is suctioned and held by the suction head 53 (in a step S7).

When a component (i.e., the bare chip) is suctioned by the first headunit 12 a (or the second head unit 12 b), the first head unit 12 a (orthe second head unit 12 b) is moved, and thereby, the bare chip islocated above the component position confirmation camera 151 a (or 151b). Then, the state in which the bare chip is suctioned is recognized(in a step S8).

Thereafter, the first head unit 12 a (or the second head unit 12 b) isplaced above the inspection plate 153. Then, the heads 13, 14 descend,and thus, the bare chip is inserted into the socket of the inspectionplate 153. Then, the bare chip is inspected (in a step S9). At thistime, in response to the recognition result in the step S8, theoperation of the first head unit 12 a (or the second head unit 12 b) iscontrolled. As a result, the bare chip is properly inserted into thesocket. During the inspection, the bare chip is continued to besuctioned and held by the head 13. Thus, the inspection is conductedwith the bare chip pressed downward by the head 13 or other suitablemechanism.

In this way, the inspection is completed, and then, a decision is madewhether or not the inspection result is a pass (in a step S10). Inresponse to the result, sorting is conducted. More specifically, if theinspection result is not a pass, the first head unit 12 a (or the secondhead unit 12 b) operates to store the bare chip as it is in the tray Tof the component storage portion 32 (in a step S13). On the other hand,if the inspection result is a pass, the first head unit 12 a (or thesecond head unit 12 b) operates to carry the bare chip as it is to thecomponent area Pa and to store it in the tape (i.e., the base tape 63).In this way, a series of operations for inspecting the bare chip iscompleted.

Herein, during the above-described inspection operations, the tray T2for below-standard components that has been placed in the componentstorage portion 32 is fully loaded. At that time, the tray T2 is sentout to the stocker 33. Then, the new empty tray T3 is carried in, andthus, the tray T is replaced, as described below. First, the traymovement mechanism operates to send out the tray T2 that is now used inthe component storage portion 32 from the component storage portion 32to the stocker 33. Next, the first head unit 12 a (or the second headunit 12 b) moves to above the empty-tray standby portion 31. After thetray suction head 15 has suctioned the empty tray T3, the head unit 12 amoves to the component storage portion 32. As a result, the empty trayT3 is moved and replaced in the component storage portion 32. Thus, theempty tray T3 is used as the tray T for storing components that havebeen determined not to meet the predetermined standard. After thisreplacement has been completed, the tray movement mechanism operates topull out the next empty tray T3, which is placed in the stocker 30 tothe empty-tray standby portion 31.

In the above-described electronic component inspection apparatus 10Iaccording to the ninth preferred embodiment, in the case where a barechip which has been removed from the wafer Wa is inspected face up, thebare-chip taking-out unit 50 may also be omitted. In this case, forexample, as shown in FIG. 47, instead of the above-described table 55 a,the configuration of the wafer placement portion 42 is provided in thecomponent standby portion 55. More specifically, the opening portion 49through which a bare chip is removed is formed in the base stand 110,and below it, the wafer movement unit 43 is provided. Using the headunits 12 a, 12 b (or the heads 13, 14), a bare chip is suctioned andpicked up directly from the wafer Wa which is held on the table 48, andthen, it is removed.

According to this configuration, after a bare chip has once beensuctioned and picked up by the head units 12 a, 12 b, the bare chip isnot received and carried out at all, before an inspection is completedand the bare chip is stored in the tape (i.e., the base tape 63) orother suitable member. Hence, there is an advantage in that a bare chipcan be inspected more accurately and reliably.

In this case, in FIG. 45, the cassette setting portion 40 may also beprovided in the portion where the wafer movement unit 43 is disposed.According to such a configuration, the cassette setting portion 40 isprevented from jutting out sideward from the base stand 110. Hence,there is an advantage in that the space that is occupied by theapparatus becomes smaller.

In such an electronic component inspection apparatus 10I according tothe ninth preferred embodiment, the inspection plate 153, the componentstandby portion 55 and the component storage portions 32, 64 arearranged in line, and thus, as the component transferring device 1000,it is sufficient that the head units 12 a, 12 b are simply arranged tomove straight. Thus, there is an advantage in that the configuration ofthe apparatus can be simplified. Also, in this apparatus, as describedabove, the head 15 for a tray is placed in the head units 12 a, 12 b.The head units 12 a, 12 b for transferring components are also used tomove and replace (or transfer) the empty tray T3 from the empty-traystandby portion 31 to the component storage portion 32. In other words,an economical and efficient configuration is realized. Therefore, theconfiguration of the apparatus is much simpler than in the case where ameans for transferring only a tray is provided. In addition, thissimpler configuration helps decrease the price of the apparatus.

Furthermore, according to this configuration, the electronic componentinspection apparatus 1I includes the function (i.e., the component areaPa) of producing a tape for a tape feeder that is used in the apparatusthat is practically installed. Hence, there is an advantage in that theperformance of a bare chip that is stored in the tape becomes morereliable. In other words, in the electronic component inspectionapparatus 1I, after being inspected, a bare chip that is held by thehead units 12 a, 12 b is stored as it is in the base tape 63, and itbecomes a product. Therefore, in a process where it becomes a tapeproduct, there is no need to transfer a bare chip between transfermechanisms. This prevents it from receiving an adverse effect, such asan impact or static electricity. Thus, the bare chip that is stored inthe tape can be properly protected from physical destruction or otherdamage, and the performance of a bare chip that is stored in the tapebecomes more reliable.

In the electronic component inspection apparatus 1I according to theninth preferred embodiment, such a configuration as described below canbe used.

For example, in the case where a bare chip that is removed from thewafer Wa is constantly inspected face up, the bare-chip taking-out unit50 may also be omitted. In that case, for example, as shown in FIG. 47,instead of the table 55 a, the configuration of the wafer placementportion 42 is provided in the component standby portion 55. Morespecifically, the opening portion 49 through which a bare chip isremoved is formed in the base stand 110, and below it, the wafermovement unit 43 is provided. Using the head units 12 a, 12 b (or theheads 13, 14), a bare chip is suctioned and picked up directly from thewafer Wa which is held on the table 48, and then, it is removed.

According to this configuration, after a bare chip has been picked uponce by the head units 12 a, 12 b, the bare chip is not received,transferred or handled again, before an inspection is completed and thebare chip is stored in the tape (i.e., the base tape 63) or othersuitable member. Hence, there is an advantage in that a bare chip can beinspected more accurately and reliably.

In this case, in FIG. 45, the cassette setting portion 40 may also beprovided in the portion where the wafer movement unit 43 is disposed.According to such a configuration, the cassette setting portion 40 isprevented from jutting out sideward from the base stand 110. Hence,there is an advantage in that the space that is occupied by theapparatus becomes smaller.

The present invention is not limited to the above-described preferredembodiments, and thus, it can be expanded and varied. Any expanded andvaried embodiments are also within the scope of the present invention.

(1) According to the first preferred embodiment, in order to connect theelectronic component D to the inspection socket 152 more reliably, basedon the recognition of its image, a shift in the suction of theelectronic component D is corrected using software. However, forexample, a component position adjustment mechanism may also be providedwhich mechanically adjusts the position of the electronic component D.

FIGS. 48A,B are an enlarged top view and sectional view of an example ofa component position adjustment mechanism 400. The component positionadjustment mechanism 400 can be placed in any position on a base standof an electronic component transfer unit.

Using the component position adjustment mechanism 400, the position ofthe electronic component D can be adjusted. This makes it possible toomit a component position confirming member such as a component positionconfirmation camera.

The component position adjustment mechanism 400 shown in FIGS. 48A-48Bpreferably includes a positional-reference portion 401, and a guideportion 402.

The positional-reference portion 401 is positioned to predeterminedcoordinates (X, Y, R) in the electronic component inspection apparatus1A. In addition, the positional-reference portion 401 includes a concaveportion that is formed so as to correspond to the external shape of theelectronic component D. In this example, the external. shape of theelectronic component D is regarded as a substantially rectangular flatplate, and thus, the positional-reference portion 401 preferably has aconcave portion that is shaped like a substantially rectangularparallelepiped and having a bottom that has a substantially rectangularshape.

The guide portion 402 has the function of a guide that leads theelectronic component D to the positional-reference portion 401. Theguide portion 402 is formed by a concave portion which is slightlylarger than the external shape of the electronic component D. In thisexample, the guide portion 402 is formed by the concave portion that ispreferably shaped like a substantially trapezoidal regular-pyramid thathas sides that extend to the four apexes of the bottom surface of thepositional-reference portion 401.

FIGS. 49A-49C show the mechanism of a positional adjustment by thecomponent position adjustment mechanism 400. As shown in this figure, inthe case where a positional adjustment is made by the component positionadjustment mechanism 400, for example, the electronic component D issuctioned and picked up by the suction nozzle 166 (or the suction nozzle16 of the head units 12 a, 12 b according to the ninth preferredembodiment) of the components transfer mechanism 160. Then, it istransferred up to above the component position adjustment mechanism 400(see FIG. 49A). Then, the suction nozzle 166 is moved down and releasesthe electronic component D, so that it is placed (or falls) into theguide portion 402 of the component position adjustment mechanism 400.Thus, the electronic component D that has been placed on the componentposition adjustment mechanism 400 is led, by its own weight (i.e.,gravitation), along the guide portion 402 to the positional-referenceportion 401. Then, the component reaches a reference position, and itsposition is adjusted (see FIG. 49B).

Thereafter, the electronic component D is suctioned by the componentstransfer mechanism 160, so that the position of the electronic componentD is corrected with respect to the components transfer mechanism 160(see FIG. 49C). As a result, the electronic component D is preciselyattached to a socket for an inspection, or such an operation isaccurately conducted.

FIG. 50 is a top view of another example of the component positionadjustment mechanism (i.e., a component position adjustment mechanism410). This component position adjustment mechanism 410 preferablyincludes two positional-reference walls 411, 412.

Each positional-reference wall 411, 412 is positioned at predeterminedcoordinates (X, Y, R) in an electronic component inspection apparatus.In addition, each wall 411, 412 has a concave portion that is formed soas to correspond to the external shape of the electronic component D. Inthis example, the external shape of the electronic component D isregarded as a substantially rectangular flat plate, and thus, thepositional-reference walls 411, 412 have reference surfaces thatcorrespond to the two sides.

FIGS. 51A-51C show the mechanism of a positional adjustment by thecomponent position adjustment mechanism shown 410. As shown in thesefigures, in the case where a positional adjustment is made by thecomponent position adjustment mechanism 410, for example, the electroniccomponent D is suctioned and moved by the suction nozzle 166 (or thesuction nozzle 16 of the head units 12 a, 12 b according to the ninthpreferred embodiment) of the components transfer mechanism 160. Then, itis transferred up to above the component position adjustment mechanism410. Thereafter, the electronic component D is placed near the corner ofthe positional-reference walls 411, 412 of the component positionadjustment mechanism 410 (see FIG. 51A).

Then, the position of the electronic component D is adjusted so that oneside of the electronic component D is pressed against the referencesurface of the positional-reference wall 411 (see FIG. 51B) Next, theone side of the electronic component D is kept pressed on the referencesurface of the positional-reference wall 411. In this state, theelectronic component D is moved to the position in which another side ofthe electronic component D is pressed against the reference surface ofthe positional-reference wall 412. In this way, the electronic componentD is pressed on both reference surfaces of the positional-referencewalls 411, 412. As a result, the position of the electronic component Dis adjusted.

Thereafter, the electronic component D is suctioned and held by thecomponents transfer mechanism 160, so that the position of theelectronic component D is corrected with respect to the componentstransfer mechanism 160 (see FIG. 51C). As a result, the electroniccomponent D is precisely attached to a socket for an inspection, or suchan operation is accurately conducted.

(2) According to the first preferred embodiment, even in any of theapparatuses, the pair of X-axis robots 120 (or the rail members 11 a, 11b according to the ninth preferred embodiment) are preferably providedon both sides (i.e., both sides in the Y-axis direction) with respect tothe tray disposition area 130, and the suction nozzle 166 or othersuitable element moves on both sides of the tray disposition area 130.However, of course, a single X-axis robot 120 or other suitable elementmay also be provided. In that case, the suction nozzle 166 or othersuitable element is moved on only one side of the tray disposition area130. According to such a configuration, the area in which the apparatusis installed in the Y-axis direction becomes smaller.

(3) According to the first preferred embodiment, the two componentstransfer mechanisms 160 are provided on the track of one X-axis robot120. However, one components transfer mechanism, or three or more, mayalso be provided on the track of one X-axis robot 120.

Furthermore, the configuration and elements located on the X-axis rail,which is the track of the X-axis robot 120, can be suitably changed anddesigned. For example, FIGS. 52A-52D are representations showing anexample of the relationship between an X-axis rail and a componentstransfer mechanism.

In FIG. 52A, an X-axis robot preferably includes two components transfermechanisms 512 a, 512 b on an X-axis rail 511. This is a configurationthat corresponds to that according to the first preferred embodiment.For example, it can be realized using a linear motor.

In FIG. 52B, an X-axis robot preferably includes components transfermechanisms 522 a, 522 b on X-axis rails 521 a, 521 b, respectively. Forexample, it can be realized using a linear motor.

In FIG. 52C, components transfer mechanisms 532 a, 532 b are provided onX-axis rails 531 a, 531 b, respectively. The X-axis robots 531 a, 531 bare each configured, using a ball screw. These ball screws are rotated,and thereby, the components transfer mechanisms 532 a, 532 b are movedon the X-axis rails 531 a, 531 b as the ball screws, respectively.

In FIG. 52D, a base body 542 is provided on an X-axis rail 541. On thebase body 542, there are provided components transfer mechanisms 543 a,543 b. Using a relatively-moving, device 544, the relative positionbetween the components transfer mechanisms 543 a, 543 b in the X-axisdirection can be changed on the base body 542. This is a configurationsimilar to that according to the ninth preferred embodiment.

The X-axis rail 541 and the relatively-moving device 544 can each beconfigured, for example, by a ball screw. These ball screws are rotated,and thereby, the base body 542 is moved along the X-axis rail 541, andthe relative position between the components transfer mechanisms 543 a,543 b is changed. These movements can be made independently. The X-axisrail 541 and the relatively-moving device 544 may each also beconfigured by a linear motor.

(4) For example, according to the first preferred embodiment, aY-direction drive portion 162 is provided in the components transfermechanism 160. Thus, the suction nozzle 166 can be moved in the Y-axisdirection. However, for example, a Y-axis robot may also be provided onthe base stand 110, so that the Y-axis robot can move the X-axis robot120 in the Y-axis direction. As a result, the suction nozzle 166 ismoved in the Y-axis direction. In this case, as the X-axis robot 120,one or two robots can be used.

(5) According to the first preferred embodiment, the empty tray T3 isprovided in the tray disposition area 130 which is provided on the basestand 110 and between both X-axis robots 120 a, 120 b. However, theempty tray T3 may also be provided outside of this area.

In this case, a stocker that stores the empty tray T3 can be separatelyprovided. Hence, using a tray transfer mechanism that is exclusivelyused, the empty tray T3 is transferred between the tray dispositionareas 130 a, 130 b, 130 c.

(6) According to the first preferred embodiment, the single suctionnozzle 166 is preferably provided in the suction head 165. However, twoor more suction nozzles 166 may also be provided. In addition, thenumber of sockets for an inspection of the inspection plate 153 may alsobe one, two or more than two. This is similar to the other preferredembodiments.

(7) The area on the tray T may also be divided in two in the Y-axisdirection, so that the area correspond to the components transfermechanisms 160 which are provided in the X-axis robots 120 according tothe first preferred embodiment, respectively. In these divided areas,electronic components are transferred separately by each of thecomponents transfer mechanisms 160 which are provided in the X-axisrobots 120. This helps shorten the distance by which the componentstransfer mechanism 160 moves in the Y-axis direction. It also helpsshorten the distance by which the tray T moves in the Y-axis directionby the Y-direction tray transfer mechanism 180. Therefore, the size ofthe apparatus in the Y-axis direction can be made smaller.

(8) According to the first preferred embodiment, communications areexchanged between the electronic component transfer unit 100A and theelectronic component inspection unit 200. However, these communicationsare not necessarily needed. For example, the inspection socket 152 ismonitored, using the inspection-position confirmation camera 154. Whenit is confirmed as a trigger that the electronic component D has beenattached to the inspection socket 152, the electronic component D startsto be transferred and inspected. Alternatively, on the inspection socket152, a mark is formed which shows the type of such a socket and thecontents of an inspection. Using the inspection-position confirmationcamera 154, this is read so that the contents of an inspection or thelike can be selected. As a result, there will be no need for theabove-described communications.

As to the inspection contents, the type of the electronic component D tobe inspected, the process of an inspection, and other characteristicscan be inspected. If a table is prepared which shows the relationshipbetween this mark and the inspection contents, proper inspectioncontents can be selected by referring to this table.

(9) According to the first preferred embodiment, in the inspection area150, in order to prevent the components transfer mechanisms 160 (or thesuction heads 165) that are provided in the different X-axis robots 120from interfering with each other, one of the suction heads 165 which mayinterfere with each other retreats in the Y-axis direction. However, theoperation for preventing such interference may also be conducted, ofcourse, outside of the inspection area 150.

Furthermore, if the plurality of components transfer mechanisms 160which are provided in the common X-axis robots 120 are moving in thedirections where they come close to each other, then the componentstransfer mechanism 160 on one side, or the components transfermechanisms 160 on both sides, are moved in the directions opposite tothe directions in which they are moving. Thereby, the componentstransfer mechanisms 160 can be prevented from colliding with each other.In this case, for example, a detecting device can be provided whichdetects, according to the output of the above-described encoder, thefact that both components transfer mechanisms 160 have come close withina certain distance between them. Based upon the detection by thedetecting device, the above-described operation for preventing such acollision can be conducted.

(10) According to the first preferred embodiment, the direction in whichthe inspection plate 153 (or the inspection sockets 152 a, 152 b) isattached is detected, by detecting the opening portion 155 which isformed in the inspection plate 153 using the opening detection portion156 (e.g., an optical sensor, a limit switch or other suitable element)on the side of the base stand 110. Instead of this, another mechanismcan also be used for detecting the direction in which the inspectionplate 153 is attached.

For example, in the apparatus according to the first preferredembodiment, a mark (e.g., a dotted or crossed mark) is preferably formedon the inspection plate 153. The mark on the inspection plate 153 isconfirmed using the inspection-position confirmation camera 154. As aresult, the direction in which the inspection plate 153 or theinspection sockets 152 a, 152 b are attached, and in addition, ifnecessary, their position (i.e., their coordinates in the X and Y-axisdirections), can be detected. In this way, if the position of theinspection plate 153 is detected in advance, the electronic components Dcan be connected more precisely and reliably to the inspection sockets152 a, 152 b.

A mark (e.g., a dotted or crossed mark) is preferably formed on eachinspection socket 152 a, 152 b. The mark on each inspection socket 152a, 152 b is confirmed using the inspection-position confirmation camera154. As a result, the direction in which each inspection socket 152 a,152 b is attached can also be detected. In this case, the direction andposition (i.e., their coordinates in the X and Y-axis directions) of theinspection sockets 152 a, 152 b themselves can be directly detected. Theelectronic component D can be certainly connected to the inspectionsockets 152 a, 152 b.

The number of such marks that are formed on each of the inspection plate153 and the inspection sockets 152 a, 152 b may be one, or two or more.For example, two marks are formed on any of the inspection plate 153 andthe inspection. sockets 152 a, 152 b, and an image of these marks iscaptured by the inspection-position confirmation camera 154. Based onthe coordinates of the two marks, the position and direction of theinspection sockets 152 a, 152 b can be detected. In this case, the marksthat are put in different positions are used, and thereby, the positionand direction of the inspection sockets 152 a, 152 b can be moreprecisely detected.

Even without such a detecting device as described above for detectingthe direction of an attachment, the position and direction of theinspection sockets 152 a, 152 b may also be detected. For example, anoperator can conduct an input operation, using an input device (such asan input switch, a mouse and a keyboard).

The other preferred embodiments have been described, mainly by targetingthe electronic component inspection apparatus 1A according to the firstpreferred embodiment. However, of course, other preferred embodimentscan be provided even according to the first to ninth preferredembodiments.

As described hereinbefore, in the electronic component inspectionapparatus according to various preferred embodiments of the presentinvention, electronic components that are placed in the componentstandby portion are transferred to the inspection portion by thecomponent transferring device. Then, after a predetermined inspection isconducted here, using the component transferring device, the electroniccomponents after they have been inspected are transferred to thecomponent storage portion that corresponds to the inspection result, andthey are stored in it. This electronic component inspection apparatus isespecially useful in inspecting electronic components efficiently andprecisely.

While the present invention has been described with respect to preferredembodiments, it will be apparent to those skilled in the art that thedisclosed invention may be modified in numerous ways and may assume manyembodiments other than those specifically set out and described above.Accordingly, it is intended by the appended claims to cover allmodifications of the invention which fall within the true spirit andscope of the invention.

1-27. (canceled)
 28. An electronic component inspection apparatus,comprising: an inspection portion which inspects a component; acomponent standby portion in which the component waits before thecomponent is inspected by the inspection portion; a component storageportion which stores the component after the component has beeninspected; a component transferring device which has a suction nozzlethat applies suction to pick up the component and transfer the componentbetween the component standby portion or the component storage portionand the inspection portion; an image capturing device arranged tocapture an image of the component that is being transferred by thecomponent transferring device; and a controlling device which transfersthe component to the inspection portion, via a position in which theimage capturing device captures an image of the component when thecomponent is held by the suction nozzle and is being transferred fromthe component standby portion to the inspection portion, and based on aresult of the captured image of the component, the controlling devicecontrols the drive of the component transferring device so that thecomponent is set in the inspection portion.
 29. The electronic componentinspection apparatus according to claim 28, wherein the inspectionportion, the component standby portion, the component storage portionand the image capturing device, are arranged along a line within a rangeof motion of the suction nozzle.
 30. The electronic component inspectionapparatus according to claim 29, wherein the component transferringdevice includes a track that extends in a direction along which theinspection portion, the component standby portion, the component storageportion and the image capturing device are disposed, and moves thesuction nozzle along the track.
 31. The electronic component inspectionapparatus according to claim 30, wherein the component transferringdevice includes a pair of the tracks arranged substantially parallel toeach other and between which the inspection portion, the componentstandby portion, the component storage portion and the image capturingdevice are disposed, and the component transferring device includes apair of suction nozzles arranged to move along the pair of tracks. 32.The electronic component inspection apparatus according to claim 30,wherein two of each of the component standby portion, the componentstorage portion and the image capturing device are provided, and saidtwo of each of the component standby portion, the component storageportion and the image capturing device are arranged along a line suchthat the inspection portion is located between each of the two componentstandby portions, the two component storage portions and the two imagecapturing devices, and the component transferring device has a pair ofthe suction nozzles which move along the track.
 33. The electroniccomponent inspection apparatus according to claim 30, wherein two ofeach of the component standby portion, the component storage portion andthe image capturing device are provided, and said two of each of thecomponent standby portion, the component storage portion and the imagecapturing device are arranged along a line such that the inspectionportion is located between each of the two component standby portions,the two component storage portions and the two image capturing devices,and the component transferring device includes a pair of the tracksarranged substantially parallel to each other and between which theinspection portion, the two component standby portions, the twocomponent storage portions and the two image capturing devices aredisposed, and the component transferring device includes a pair ofsuction nozzles arranged to move along the pair of tracks.
 34. Anelectronic component inspection apparatus comprising: an inspectionportion which inspects a component; a component standby portion in whichthe component waits before the component is inspected by the inspectionportion; a component storage portion which stores the component afterthe component has been inspected; a component transferring device whichhas a suction nozzle that applies suction to pick up the component andtransfer the component between the component standby portion or thecomponent storage portion and the inspection portion; wherein theinspection portion, the component standby portion and the componentstorage portion are arranged along a line within a range of motion ofthe suction nozzle.
 35. The electronic component inspection apparatusaccording to claim 34, wherein the component transferring device has atrack which extends in a direction along which the inspection portion,the component standby portion and the component storage portion aredisposed, and moves the suction nozzle along the track.
 36. Theelectronic component inspection apparatus according to claim 35, whereinthe component transferring device includes a pair of the tracks arrangedto extend substantially parallel to each other and between which theinspection portion, the component standby portion and the componentstorage portion are disposed, and the component transferring deviceincludes a pair of suction nozzles which moves along the tracks.
 37. Theelectronic component inspection apparatus according to claim 35, whereintwo of the component standby portion and the component storage portionare provided and arranged along a line such that the inspection portionis located between the two component standby portions and the twocomponent storage portions, and the component transferring device has apair of the suction nozzles that moves along the track.
 38. Theelectronic component inspection apparatus according to claim 35, whereintwo of the component standby portion and the component storage portionare provided and arranged along a line such that the inspection portionis located between the two component standby portions and the twocomponent storage portions, and the component transferring device has apair of the tracks arranged to extend substantially parallel to eachother and between which the inspection portion and the two componentstandby portions and the two component storage portions are disposed,and includes a pair of the suction nozzles which moves along the tracks.39. The electronic component inspection apparatus according to claim 31,further comprising: a detecting device for detecting whether the suctionnozzles, which move along the track, come within a close-state conditiondefined by a pretermined interval between the pair of suction nozzles;and a collision-prevention controlling device for, based on theclose-state detection by the detecting device, controlling the drive ofthe component transferring device, so that the suction nozzles areprevented from colliding.
 40. The electronic component inspectionapparatus according to claim 39, wherein the pair of suction nozzlesmoves along the track and based on the close-state detection by thedetecting device, the collision-prevention controlling device moves atleast one suction nozzle of the pair of suction nozzles in an oppositedirection.
 41. The electronic component inspection apparatus accordingto claim 39, wherein the suction nozzles each move along a pair of thetracks, and the component transferring device moves at least one suctionnozzle of the suction nozzles in directions other than the directions ofthe tracks, and based on the close-state detection by the detectingdevice, the collision-prevention controlling device moves the suctionnozzles in directions other than the directions of the tracks.
 42. Theelectronic component inspection apparatus according to claim 28, whereinat least one of the component standby portion and the component storageportion holds a component which is stored in a container.
 43. Theelectronic component inspection apparatus according to claim 42,wherein: the container that holds the component before the component hasbeen inspected is positioned in the component standby portion; thecontainer that holds the component after the component has beeninspected is positioned in the component storage portion; and thecontainers are each arranged in a line along the track.
 44. Theelectronic component inspection apparatus according to claim 42, furthercomprising a container moving device for moving the container along ahorizontal plane, in directions other than the directions in which thesuction nozzle moves.
 45. The electronic component inspection apparatusaccording to claim 44, wherein the container moving device moves thecontainer in directions substantially perpendicular to the directions inwhich the suction nozzle moves.
 46. The electronic component inspectionapparatus according to claim 44, wherein: the container that holds thecomponent before the component has been inspected is positioned in thecomponent standby portion; the container that holds the component afterthe component has been inspected is positioned in the component storageportion; and the container moving device moves each of the containersindependently of each of the respective component standby portion andthe component storage portion.
 47. The electronic component inspectionapparatus according to claim 42, further comprising: container storageportion in which the container is removed from and put into, thecomponent standby portion or the component storage portion; and acontainer transferring device which transfers the container between thecomponent standby portion or the component storage portion and thecontainer storage portion.
 48. The electronic component inspectionapparatus according to claim 47, wherein two container storage portionsare provided, a respective one of the two container storage portions isprovided in each of the component standby portion and the componentstorage portion, and the two container storage portions arranged in therespective component standby portion and the component storage portionare disposed in a line along the track.
 49. The electronic componentinspection apparatus according to claim 47, further comprising acontainer moving device, wherein the container moving device performs afunction of the container transferring device to remove from and putinto the container storage portion one of the containers.
 50. Theelectronic component inspection apparatus according to claim 49 whereinthe component transferring device transfers the one of the containersalong the track.
 51. The electronic component inspection apparatusaccording to claim 28, wherein the component standby portion is arrangedto hold a wafer on which a chip component in a diced state defining thecomponent is held.
 52. The electronic component inspection apparatusaccording to claim 28, wherein: the component standby portion places asa unit a chip component which defines the component; wafer placementportion is provided on a side of the component standby portion and inwhich a wafer with the chip component in a diced state is placed, and achip-component removal device is provided which removes and moves thechip component from the wafer placement portion to the component standbyportion; the chip-component removal device switches from a state inwhich the chip component is lifted from the wafer and is held face up,to a state in which the chip component is turned over from the removedstate and is held face down; and the component transferring deviceapplies suction using the suction nozzle to the chip component which isplaced face up in the component standby portion or the chip componentwhich is placed face down by the chip-component removal device, andtransfers the chip component to the inspection portion.
 53. Theelectronic component inspection apparatus according to claim 51, whereinthe component standby portion is arranged to hold a plurality ofcomponents that are stored in a container, and the position in which thewafer with the chip component in the diced state stands by, and theposition in which the plurality of components which is stored in thecontainer stands by, are arranged in a line along the track.
 54. Theelectronic component inspection apparatus according to claim 28,wherein: the component storage portion includes a packaging device forproviding a component storage tape which has a plurality of concaveportions arranged in a line for storing in the concave portions of thecomponent storage tape components after the components have beeninspected, and for covering with a cover tape the openings of theconcave portions after the components are stored therein; and thecomponent transferring device stores the components after the componentsare inspected in the concave portions of the tape.
 55. The electroniccomponent inspection apparatus according to claim 32, furthercomprising: a detecting device for detecting whether the suctionnozzles, which move along the track, come within a close-state conditiondefined by a pretermined interval between the pair of suction nozzles;and a collision-prevention controlling device for, based on theclose-state detection by the detecting device, controlling the drive ofthe component transferring device, so that the suction nozzles areprevented from colliding.
 56. The electronic component inspectionapparatus according to claim 33, further comprising: a detecting devicefor detecting whether the suction nozzles, which move along the track,come within a close-state condition defined by a pretermined intervalbetween the pair of suction nozzles; and a collision-preventioncontrolling device for, based on the close-state detection by thedetecting device, controlling the drive of the component transferringdevice, so that the suction nozzles are prevented from colliding. 57.The electronic component inspection apparatus according to claim 36,further comprising: a detecting device for detecting whether the suctionnozzles, which move along the track, come within a close-state conditiondefined by a pretermined interval between the pair of suction nozzles;and a collision-prevention controlling device for, based on theclose-state detection by the detecting device, controlling the drive ofthe component transferring device, so that the suction nozzles areprevented from colliding.
 58. The electronic component inspectionapparatus according to claim 37, further comprising: a detecting devicefor detecting whether the suction nozzles, which move along the track,come within a close-state condition defined by a pretermined intervalbetween the pair of suction nozzles; and a collision-preventioncontrolling device for, based on the close-state detection by thedetecting device, controlling the drive of the component transferringdevice, so that the suction nozzles are prevented from colliding. 59.The electronic component inspection apparatus according to claim 38,further comprising: a detecting device for detecting whether the suctionnozzles, which move along the track, come within a close-state conditiondefined by a pretermined interval between the pair of suction nozzles;and a collision-prevention controlling device for, based on theclose-state detection by the detecting device, controlling the drive ofthe component transferring device, so that the suction nozzles areprevented from colliding.
 60. The electronic component inspectionapparatus according to claim 52, wherein the component standby portionis arranged to hold a plurality of components that are stored in acontainer, and the position in which the wafer with the chip componentin the diced state stands by, and the position in which the plurality ofcomponents which is stored in the container stands by, are arranged in aline along the track.